BS EN 60749-20:2003

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Semiconductor devices. Mechanical and climatic test methods – Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Published By	Publication Date	Number of Pages
BSI	2003	28

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Applies to semiconductor devices (discrete devices and integrated circuits) – and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.

Additional information

Status	Withdrawn
Title	Semiconductor devices. Mechanical and climatic test methods – Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Replaces	BS EN 60749:1999
Publisher	BSI
Committee	EPL/47
Pages	28
Publication Date	2003-07-07
Withdrawn Date	2010-01-31
Replaced By	BS EN 60749-20:2009
ISBN	0 580 42197 X
Standard Number	BS EN 60749-20:2003
Identical National Standard Of	IEC 60749-20:2002, EN 60749-20:2003
Descriptors	Encapsulated, Electronic equipment and components, Thermal testing, Environmental testing, Damp-heat tests, Solderability testing, Integrated circuits, Mechanical testing, Plastics, Climate, Surface mounting devices, Soldering, Semiconductor devices
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749-20:2003

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