BS EN 60749-35:2006

$142.49

Semiconductor devices. Mechanical and climatic test methods – Acoustic microscopy for plastic encapsulated electronic components

Published By	Publication Date	Number of Pages
BSI	2006	24

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

Additional information

Status	Definitive
Pages	24
Publication Date	2006-11-30
ISBN	0 580 49739 9
Standard Number	BS EN 60749-35:2006
Title	Semiconductor devices. Mechanical and climatic test methods – Acoustic microscopy for plastic encapsulated electronic components
Identical National Standard Of	IEC 60749-35:2006, EN 60749-35:2006, IEC 60749-35:2006, EN 61140:2002
Descriptors	Integrated circuits, Mechanical testing, Non-destructive testing, Microscopic analysis, Semiconductor devices, Plastics, Encapsulated, Electronic equipment and components, Test equipment, Environmental testing, Packages, Ultrasonic testing, Climate
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749-35:2006

$142.49


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