ASTM-F615M:2008 Edition

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F615M-95(2008) Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric)

Published By	Publication Date	Number of Pages
ASTM	2008	5

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Category: ASTM

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Description

ASTM F615M-95-Reapproved2008

Historical Standard: Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric)

ASTM F615M

Scope

1.1 This practice covers procedures for determining operating regions that are safe from metallization burnout induced by current pulses of less than 1-s duration.

Note 1—In this practice, “metallization” refers to metallic layers on semiconductor components such as interconnect patterns on integrated circuits. The principles of the practice may, however, be extended to nearly any current-carrying path. The term “burnout” refers to either fusing or vaporization.

1.2 This practice is based on the application of unipolar rectangular current test pulses. An extrapolation technique is specified for mapping safe operating regions in the pulse-amplitude versus pulse-duration plane. A procedure is provided in Appendix X2 to relate safe operating regions established from rectangular pulse data to safe operating regions for arbitrary pulse shapes.

1.3 This practice is not intended to apply to metallization damage mechanisms other than fusing or vaporization induced by current pulses and, in particular, is not intended to apply to long-term mechanisms, such as metal migration.

1.4 This practice is not intended to determine the nature of any defect causing failure.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

current pulse; current pulse burnout; metallization burnout; safe current pulse; semiconductor burnout; Burnout resistance; Current measurement–semiconductors; Current pulse burnout; Destructive testing–semiconductors; Electrical conductors (semiconductors); Electrical resistance/resistivity–semiconductors; Metallization burnout; Pulse testing; Rectangular current test pulse application; Safe current pulse; Semiconductor burnout; Silicon semiconductors

ICS Code

ICS Number Code 29.045 (Semiconducting materials)

DOI: 10.1520/F0615M-95R08

PDF Catalog

PDF Pages	PDF Title
1	Scope Summary of Test Method Significance and Use Apparatus Conditioning Procedure
2	Interpretation Report Precision and Bias Keywords A1. DESCRIPTION OF OVEN A1.1 A1.2 A1.3 A1.4 A2. PLACING OF FITTINGS IN OVEN A2.1 A2.2 A2.3 TABLE 1 FIG. A2.1
3	A2.4 X1. SUGGESTED INTERPRETATION OF RESULTS X1.1 X1.2 FIG. A2.2 FIG. X1.1
4	FIG. X1.2 FIG. X1.3

Additional information

Standard Title	F615M-95(2008) Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric)
Published Code	ASTM
Publication Date	2008
Pages Count	5