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BS EN IEC 62150-6:2022

BS EN IEC 62150-6:2022

$142.49

Fibre optic active components and devices. Test and measurement procedures – Universal mezzanine boards for test and measurement of photonic devices

Published By Publication Date Number of Pages
BSI 2022 28
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This part of IEC 62150 specifies a generic mezzanine board system to support test and measurement of devices based on micro-optical and micro-photonic technologies, including but not limited to photonic integrated circuit (PIC) devices.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
6 Blank Page
7 English
CONTENTS
8 FOREWORD
10 INTRODUCTION
11 1 Scope
2 Normative references
3 Terms and definitions
12 4 Mezzanine board requirements
4.1 Functional description
Figures
Figure 1 – Outlines of mezzanine test boards
13 Figure 2 – Attachment of PDS onto M2 board
14 4.2 Critical dimensions
Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal connectors on top and bottom surfaces and mezzanine board origin
15 Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal connectors on top and bottom surfaces and mezzanine board origin
Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power and low speed signal connectors on bottom surfaces and mezzanine board origin
16 4.3 Daughtercard and extended system
Table 1 – Critical relative dimensions
17 Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard with electrical edge connectors and cut-outs to accommodate optical backplane connectors
18 Figure 7 – Attachment of M2 boards onto daughtercard
19 Figure 8 – Extended double Eurocard form factor daughtercard with two M2 boards attached
Figure 9 – Extended double Eurocard form factor daughtercard with four M1 boards attached
20 4.4 Power and signal flows
Figure 10 – Extended double Eurocard form factor daughtercard with two M1 boards and one M2 board attached
21 Figure 11 – Functional diagram showing power and low speed signal distribution between PDS, M1/M2, daughtercard and backplane
Table 2 – Voltages and low-power signal designations
22 Figure 12 – Multiple daughtercards populated with M1/M2and PDS in multiple slots on a system backplane
23 Annex A (informative)International collaborative research and development
A.1 Overview
Figure A.1 – Example of cross-project deployment of mezzanine test card [3]
24 A.2 European FP7 PhoxTroT project
A.3 European H2020 Nephele project
A.4 European H2020 COSMICC project
25 A.5 Benefit of universal test board
Figure A.2 – Examples of M2 test boards developed on EU H2020 COSMICC project
26 Bibliography

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BS EN IEC 62150-6:2022
$142.49