EIA 534-1988

$21.45

Ceramic Capacitor Applications Guide Soldering and Solderability Maintenance of Leaded Electronic Components

Published By	Publication Date	Number of Pages
ECIA	1988	8

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Category: ECIA

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Description

BACKGROUND AND PURPOSE

Leaded Electronic Component parts are subjected to a wide
variety of internal stresses during the soldering of their
terminations by solder dips, soldering irons, or automatic wave
soldering techniques. The heat can either be conducted through the
metal termination into the body of the component part, or absorbed
directly or indirectly as radiant heat emanating from solder baths,
waves or preheaters, or both. This document is intended as a guide
for users of leaded electronic component parts that exist today.
Furthermore, recommendations are given on the cleaning, retinning,
packaging and storage of these component parts. it is recognized
that many components behave differently during installation and
lead retinning operations. Hermetically sealed components must be
treated differently from non-hermetic sealed types. Other solder
compositions than those recommended in this guide may be used.
Solder irons of different mass and tip temperatures may be used
providing the end result is not detrimental to the component. This
document is intended as a guideline only and in many cases
manufacturers' suggested procedures should be used.