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IEC TR 60068-3-12:2014

IEC TR 60068-3-12:2014

$33.15

Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile

Published By Publication Date Number of Pages
IEC 2014-10-17 40
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IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition:
– the content has been adapted to the state-of-the-art of reflow-oven technology and termination finishes;
– minor language adjustments were performed.

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IEC TR 60068-3-12:2014
$33.15