{"id":226418,"date":"2024-10-19T14:42:56","date_gmt":"2024-10-19T14:42:56","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-ts-628612017\/"},"modified":"2024-10-25T08:39:39","modified_gmt":"2024-10-25T08:39:39","slug":"bsi-pd-iec-ts-628612017","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-ts-628612017\/","title":{"rendered":"BSI PD IEC\/TS 62861:2017"},"content":{"rendered":"<p>This Technical Specification provides guidelines for establishing confidence in product reliability using principal component testing for LED light sources and LED luminaires for general lighting. It includes methods and criteria using initial qualification tests and accelerated stress tests of the principal components. The performance of any principal component will influence the performance of the final product.<\/p>\n<p>Techniques to validate full lifetime claims and lumen maintenance projection are outside the scope of this Technical Specification.<\/p>\n<p>The following principal components are included in the testing if they are used as an integral part for the LED light source or LED luminaire:<\/p>\n<ul>\n<li>\n<p>LED package and interconnects;<\/p>\n<\/li>\n<li>\n<p>optical materials;<\/p>\n<\/li>\n<li>\n<p>electronic subassemblies;<\/p>\n<\/li>\n<li>\n<p>cooling systems, both active (e.g. fans) and passive (e.g. thermal interface material);<\/p>\n<\/li>\n<li>\n<p>construction materials.<\/p>\n<\/li>\n<\/ul>\n<p>This Technical Specification is not recommended for use as a normative reference to the LED product performance standards.<\/p>\n<h4>PDF Catalog<\/h4>\n<table border=\"1px\" class=\"des-table\">\n<tr>\n<th>PDF Pages<\/th>\n<th>PDF Title<\/th>\n<\/tr>\n<tr>\n<td><b>4<b><\/td>\n<td>CONTENTS  <\/td>\n<\/tr>\n<tr>\n<td><b>8<b><\/td>\n<td>FOREWORD  <\/td>\n<\/tr>\n<tr>\n<td><b>10<b><\/td>\n<td>INTRODUCTION  <\/td>\n<\/tr>\n<tr>\n<td><b>11<b><\/td>\n<td>1 Scope <br \/> 2 Normative references  <\/td>\n<\/tr>\n<tr>\n<td><b>12<b><\/td>\n<td>3 Terms and definitions  <\/td>\n<\/tr>\n<tr>\n<td><b>15<b><\/td>\n<td>4 Component test conditions  <\/td>\n<\/tr>\n<tr>\n<td><b>16<b><\/td>\n<td>5 LED package and interconnects <br \/> 5.1 General <br \/> 5.2 Sampling requirements <br \/> 5.3 Production requirements  <\/td>\n<\/tr>\n<tr>\n<td><b>17<b><\/td>\n<td>5.4 Assembly of LED packages on test boards <br \/> 5.5 Moisture preconditioning <br \/> 5.6 Thermal characteristics <br \/> 5.7 Pre- and post-stress electrical and photometric requirements <br \/> 5.8 Pre- and post-stress visual inspection <br \/> 5.9 Solderability and resistance to soldering heat <br \/> 5.9.1 Solderability <br \/> 5.9.2 Resistance to soldering heat (RSH-reflow) test  <\/td>\n<\/tr>\n<tr>\n<td><b>18<b><\/td>\n<td>5.10 Failure criteria <br \/> 5.11 Initial qualification tests for LED packages <br \/> 5.11.1 General  <\/td>\n<\/tr>\n<tr>\n<td><b>19<b><\/td>\n<td>5.11.2 Temperature and operation stress  <\/td>\n<\/tr>\n<tr>\n<td><b>20<b><\/td>\n<td>5.11.3 Thermo-mechanical stress <br \/> 5.11.4 Temperature and humidity stress  <\/td>\n<\/tr>\n<tr>\n<td><b>21<b><\/td>\n<td>5.11.5 Electrical stress \u2013 ESD-HBM <br \/> 5.11.6 Environmental stress  <\/td>\n<\/tr>\n<tr>\n<td><b>22<b><\/td>\n<td>5.12 Initial qualification test for LED package interconnects \u2013 VVF <br \/> 5.13 Accelerated stress tests for LED package interconnects <br \/> 5.13.1 General <br \/> Tables <br \/> Table 1 \u2013 Mapping the LED package interconnects qualification tests to the useable acceleration model with typical range of the acceleration factor  <\/td>\n<\/tr>\n<tr>\n<td><b>23<b><\/td>\n<td>5.13.2 Interconnect temperature cycling (TMCL) <br \/> 6 Optical materials <br \/> 6.1 General <br \/> Table 2 \u2013 Duration (cycles) of temperature application  <\/td>\n<\/tr>\n<tr>\n<td><b>24<b><\/td>\n<td>6.2 Optical material test samples <br \/> 6.3 Moisture preconditioning <br \/> 6.4 Pre- and post-stress photometric measurements  <\/td>\n<\/tr>\n<tr>\n<td><b>25<b><\/td>\n<td>6.5 Adhesion test <br \/> 6.6 Pre- and post-stress visual inspection <br \/> 6.7 Failure criteria <br \/> 6.8 Initial qualification tests <br \/> 6.8.1 Relative humidity (RH)  <\/td>\n<\/tr>\n<tr>\n<td><b>26<b><\/td>\n<td>6.8.2 Boiling water (BW) <br \/> 6.8.3 Oven water (OW) <br \/> 6.8.4 High temperature exposure (HTE) <br \/> 6.9 Accelerated stress tests <br \/> 6.9.1 Prediction models <br \/> Table 3 \u2013 Mapping of the optical-material related accelerated stress tests  <\/td>\n<\/tr>\n<tr>\n<td><b>27<b><\/td>\n<td>6.9.2 Temperature and humidity (TH) <br \/> 6.9.3 Temperature and light exposure (TL)  <\/td>\n<\/tr>\n<tr>\n<td><b>28<b><\/td>\n<td>6.10 Light-transmitting materials <br \/> 6.11 Light-reflecting materials <br \/> 6.11.1 Dichroic-coated glass and aluminium-coated glass <br \/> 6.11.2 Aluminium-coated plastic <br \/> 6.11.3 White plastic\/non-coated plastic  <\/td>\n<\/tr>\n<tr>\n<td><b>29<b><\/td>\n<td>6.12 Optical converters <br \/> 7 Electronic subassemblies <br \/> 7.1 General <br \/> 7.2 Sampling requirements <br \/> 7.3 Production requirements  <\/td>\n<\/tr>\n<tr>\n<td><b>30<b><\/td>\n<td>7.4 Pre- and post-stress electrical requirements <br \/> 7.5 Pre- and post-stress visual inspection <br \/> 7.6 Failure criteria <br \/> 7.7 Initial qualification tests <br \/> 7.7.1 Temperature and operation stress (PTC)  <\/td>\n<\/tr>\n<tr>\n<td><b>31<b><\/td>\n<td>7.7.2 Humidity and operation stress (HOT) <br \/> 7.8 Accelerated stress tests <br \/> 7.8.1 Prediction models <br \/> 7.8.2 Temperature, humidity and operation stress (sequential ALT) <br \/> Table 4 \u2013 Mapping the electronic subassembly qualification tests to the useable acceleration model with typical range of the acceleration factor  <\/td>\n<\/tr>\n<tr>\n<td><b>32<b><\/td>\n<td>8 Active and passive cooling systems <br \/> 8.1 General <br \/> Table 5 \u2013 Example ALT profile for an electronic subassembly  <\/td>\n<\/tr>\n<tr>\n<td><b>33<b><\/td>\n<td>8.2 Cooling system test samples <br \/> Table 6 \u2013 Examples of stressors, affected part of the cooling systems and its reliability effect.  <\/td>\n<\/tr>\n<tr>\n<td><b>34<b><\/td>\n<td>8.3 Moisture preconditioning <br \/> 8.4 Thermal resistance test <br \/> 8.5 Performance parameter test <br \/> 8.6 Pre- and post-stress cooling performance requirements <br \/> 8.7 Pre- and post-stress visual inspection <br \/> 8.8 Failure criteria  <\/td>\n<\/tr>\n<tr>\n<td><b>35<b><\/td>\n<td>8.9 Initial qualification tests <br \/> 8.9.1 General <br \/> 8.9.2 Dust  <\/td>\n<\/tr>\n<tr>\n<td><b>36<b><\/td>\n<td>8.10 Accelerated stress tests <br \/> 8.10.1 General <br \/> 8.10.2 Cyclic temperature test (CT) with humidity and with\/without operational stress <br \/> 8.10.3 Temperature life test (TLT) passive cooling system <br \/> Table 7 \u2013 Mapping the cooling system qualification tests to the useable acceleration model with typical range of the acceleration factor  <\/td>\n<\/tr>\n<tr>\n<td><b>37<b><\/td>\n<td>8.10.4 Temperature life test (TLT) active cooling system <br \/> 9 Construction materials <br \/> 9.1 General  <\/td>\n<\/tr>\n<tr>\n<td><b>38<b><\/td>\n<td>9.2 Mechanical components and interconnects <br \/> 9.3 Mechanical interfaces between different components  <\/td>\n<\/tr>\n<tr>\n<td><b>39<b><\/td>\n<td>9.4 Chemical interactions  <\/td>\n<\/tr>\n<tr>\n<td><b>40<b><\/td>\n<td>10 Final product testing <br \/> 10.1 General <br \/> 10.2 Principal component reliability in the final product <br \/> Table 8 \u2013 List of undesired chemicals in LED products for general lighting.  <\/td>\n<\/tr>\n<tr>\n<td><b>41<b><\/td>\n<td>10.3 Minimum validated AST time <br \/> Table 9 \u2013 Influence of the principal components on the final product.  <\/td>\n<\/tr>\n<tr>\n<td><b>42<b><\/td>\n<td>10.4 Final product qualification for reliability <br \/> 11 Product updates <br \/> Table 10 \u2013 Example list of validated AST times.  <\/td>\n<\/tr>\n<tr>\n<td><b>43<b><\/td>\n<td>Table 11 \u2013 Minor and major change list per principal component.  <\/td>\n<\/tr>\n<tr>\n<td><b>44<b><\/td>\n<td>Annex\u00a0A (informative)Application profiles <br \/> Table A.1 \u2013 Example of two application profiles  <\/td>\n<\/tr>\n<tr>\n<td><b>45<b><\/td>\n<td>Annex\u00a0B (informative)Acceleration models <br \/> B.1 General <br \/> B.2 Arrhenius model  <\/td>\n<\/tr>\n<tr>\n<td><b>46<b><\/td>\n<td>B.3 Eyring model <br \/> B.4 Coffin-Manson model <br \/> B.5 Norris-Landzberg model  <\/td>\n<\/tr>\n<tr>\n<td><b>47<b><\/td>\n<td>B.6 (Inverse) power law <br \/> B.7 Peck model <br \/> B.8 Generalized Eyring model  <\/td>\n<\/tr>\n<tr>\n<td><b>48<b><\/td>\n<td>B.9 Sample size calculation  <\/td>\n<\/tr>\n<tr>\n<td><b>49<b><\/td>\n<td>B.10 Basic guidelines <br \/> B.11 Example <br \/> Table B.1 \u2013 Sample sizes versus confidence and reliability level assuming L = T\u00a0\u00d7\u00a0AF  <\/td>\n<\/tr>\n<tr>\n<td><b>50<b><\/td>\n<td>Table B.2 \u2013 Example of calculated acceleration factors  <\/td>\n<\/tr>\n<tr>\n<td><b>51<b><\/td>\n<td>Annex\u00a0C (informative)System reliability <br \/> C.1 General <br \/> C.2 Basic principles <br \/> C.3 Testing on the system level  <\/td>\n<\/tr>\n<tr>\n<td><b>52<b><\/td>\n<td>C.4 System reliability prediction <br \/> C.4.1 General <br \/> C.4.2 Block diagrams  <\/td>\n<\/tr>\n<tr>\n<td><b>53<b><\/td>\n<td>C.4.3 Fault tree <br \/> C.4.4 Markov chains <br \/> C.4.5 Bayesian networks  <\/td>\n<\/tr>\n<tr>\n<td><b>54<b><\/td>\n<td>C.4.6 Chi-square  <\/td>\n<\/tr>\n<tr>\n<td><b>55<b><\/td>\n<td>Table C.1 \u2013 Example test scheme and results for Chi-square.  <\/td>\n<\/tr>\n<tr>\n<td><b>56<b><\/td>\n<td>Annex\u00a0D (informative)Qualification flowcharts <br \/> D.1 General <br \/> D.2 Qualification flowcharts of principal components <br \/> Figures <br \/> Figure D.1 \u2013 Qualification flowchart for LED package and interconnects  <\/td>\n<\/tr>\n<tr>\n<td><b>57<b><\/td>\n<td>Figure D.2 \u2013 Qualification flowchart for optical materials  <\/td>\n<\/tr>\n<tr>\n<td><b>58<b><\/td>\n<td>Figure D.3 \u2013 Qualification flowchart for electronic subassemblies  <\/td>\n<\/tr>\n<tr>\n<td><b>59<b><\/td>\n<td>Figure D.4 \u2013 Qualification flowchart for active and passive cooling systems  <\/td>\n<\/tr>\n<tr>\n<td><b>60<b><\/td>\n<td>Figure D.5 \u2013 Qualification flowchart for construction materials  <\/td>\n<\/tr>\n<tr>\n<td><b>61<b><\/td>\n<td>Annex\u00a0E (informative)Physical analysis for principal components <br \/> E.1 General <br \/> E.2 DPA for LED packages and interconnects  <\/td>\n<\/tr>\n<tr>\n<td><b>62<b><\/td>\n<td>E.3 DPA for optical materials <br \/> E.4 PA for electronics  <\/td>\n<\/tr>\n<tr>\n<td><b>63<b><\/td>\n<td>E.5 PA for active and passive cooling systems <br \/> E.6 DPA for mechanical  <\/td>\n<\/tr>\n<tr>\n<td><b>64<b><\/td>\n<td>Annex\u00a0F (normative)Principal component test report  <\/td>\n<\/tr>\n<tr>\n<td><b>65<b><\/td>\n<td>Table\u00a0F.1 \u2013 Example overview reporting format  <\/td>\n<\/tr>\n<tr>\n<td><b>66<b><\/td>\n<td>Bibliography  <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p><b>Guidelines for principal component reliability testing for LED light sources and LED luminaires<\/b><\/p>\n<table class=\"shortdes-table\" style=\"width: 100%\" border=\"0\" cellspacing=\"0\" cellpadding=\"0\">\n<tbody>\n<tr>\n<td>Published By<\/td>\n<td>Publication Date<\/td>\n<td>Number of Pages<\/td>\n<\/tr>\n<tr>\n<td><a href=\"https:\/\/pdfstandards.shop\/product-category\/publishers\/bsi\/\"><b>BSI<\/b><\/a><\/td>\n<td>2017<\/td>\n<td>70<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":226422,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[526,2641],"product_tag":[],"class_list":{"0":"post-226418","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-29-140-99","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/226418","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/226422"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=226418"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=226418"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=226418"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}