{"id":372132,"date":"2024-10-20T02:27:53","date_gmt":"2024-10-20T02:27:53","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-61189-5-5022021\/"},"modified":"2024-10-26T04:17:37","modified_gmt":"2024-10-26T04:17:37","slug":"bs-en-iec-61189-5-5022021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-61189-5-5022021\/","title":{"rendered":"BS EN IEC 61189-5-502:2021"},"content":{"rendered":"
IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.<\/p>\n
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 3 Terms and definitions 4 Equipment\/Apparatus 4.1 Soldering and other production process equipment 4.2 Measurement instrument <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 4.3 Resistor verification coupon 4.4 Damp heat chamber Figures Figure 1 \u2013 Resistor verification coupon using the IPC-B-52 coupon <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 4.5 Magnifiers (10x \u2013 30x) 4.6 Camera 4.7 Cleaning solvent 4.8 Interconnecting cable 4.9 Connector rack 4.10 Solder flux 5 Test coupon 5.1 Test coupon artwork 5.1.1 General <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 5.1.2 Test coupon 5.1.3 Laminate 5.1.4 Surface finish 5.1.5 Solder mask 5.1.6 Quality 5.2 Components (bill of materials) <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Figure 2 \u2013 IPC B-52 Rev B top side Figure 3 \u2013 IPC B-52 Rev B bottom side <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 5.3 Number of test coupons 5.4 Test conditions Table 1 \u2013 IPC B-52 bill of materials (BOM) <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 5.5 Coupon identification 6 Procedure 6.1 Test coupon preparation 6.2 Cleaning 6.3 Manufacturing process replication 6.4 Preparation of samples for chamber 6.5 Connector system \u2013 High-resistance measurement verification <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 6.6 Hard wiring 6.7 Coupon orientation in the chamber 6.8 Test coupon measurements Figure 4 \u2013 Test specimen location with respect to chamber air flow <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 6.9 Evaluation 6.10 Test report <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 6.11 Additional information <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Annex A (informative)Additional information A.1 Additional information A.1.1 General A.1.2 Advisory notes A.1.3 Use of coupon test pattern on production product A.2 Use of dummy components A.3 Frequency of monitoring <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | A.4 Condensation A.5 Flux volatilisation A.5.1 General A.5.2 90 % RH or 93 % RH A.6 Drip shield <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | A.7 Inspection A.8 Connector test racks A.8.1 Advantages A.8.2 Disadvantages A.9 Electromagnetic shielding <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | A.10 Wiring to the IPC B-52 test coupons Table A.1 \u2013 IPC B-52 Rev B wiring diagram <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | A.11 Connector test rack wiring A.12 Test voltage <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Test methods for electrical materials, printed board and other interconnection structures and assemblies – General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies<\/b><\/p>\n |