{"id":402223,"date":"2024-10-20T05:00:09","date_gmt":"2024-10-20T05:00:09","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-62150-62022\/"},"modified":"2024-10-26T08:52:59","modified_gmt":"2024-10-26T08:52:59","slug":"bs-en-iec-62150-62022","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-62150-62022\/","title":{"rendered":"BS EN IEC 62150-6:2022"},"content":{"rendered":"
This part of IEC 62150 specifies a generic mezzanine board system to support test and measurement of devices based on micro-optical and micro-photonic technologies, including but not limited to photonic integrated circuit (PIC) devices.<\/p>\n
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | Blank Page <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4 Mezzanine board requirements 4.1 Functional description Figures Figure 1 \u2013 Outlines of mezzanine test boards <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Figure 2 \u2013 Attachment of PDS onto M2 board <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 4.2 Critical dimensions Figure 3 \u2013 Mezzanine board 1 (M1) \u2013 Relative positions of power and low speed signal connectors on top and bottom surfaces and mezzanine board origin <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure 4 \u2013 Mezzanine board 2 (M2) \u2013 Relative positions of power and low speed signal connectors on top and bottom surfaces and mezzanine board origin Figure 5 \u2013 Power distribution and sensor board (PDS) \u2013 Relative positions of power and low speed signal connectors on bottom surfaces and mezzanine board origin <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 4.3 Daughtercard and extended system Table 1 \u2013 Critical relative dimensions <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Figure 6 \u2013 Outline dimensions of extended double Eurocard form factor daughtercard with electrical edge connectors and cut-outs to accommodate optical backplane connectors <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Figure 7 \u2013 Attachment of M2 boards onto daughtercard <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Figure 8 \u2013 Extended double Eurocard form factor daughtercard with two M2 boards attached Figure 9 \u2013 Extended double Eurocard form factor daughtercard with four M1 boards attached <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 4.4 Power and signal flows Figure 10 \u2013 Extended double Eurocard form factor daughtercard with two M1 boards and one M2 board attached <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Figure 11 \u2013 Functional diagram showing power and low speed signal distribution between PDS, M1\/M2, daughtercard and backplane Table 2 \u2013 Voltages and low-power signal designations <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Figure 12 \u2013 Multiple daughtercards populated with M1\/M2and PDS in multiple slots on a system backplane <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Annex A (informative)International collaborative research and development A.1 Overview Figure A.1 \u2013 Example of cross-project deployment of mezzanine test card [3] <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | A.2 European FP7 PhoxTroT project A.3 European H2020 Nephele project A.4 European H2020 COSMICC project <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | A.5 Benefit of universal test board Figure A.2 \u2013 Examples of M2 test boards developed on EU H2020 COSMICC project <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Fibre optic active components and devices. Test and measurement procedures – Universal mezzanine boards for test and measurement of photonic devices<\/b><\/p>\n |