{"id":419797,"date":"2024-10-20T06:27:39","date_gmt":"2024-10-20T06:27:39","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60191-6-202010-2\/"},"modified":"2024-10-26T12:04:28","modified_gmt":"2024-10-26T12:04:28","slug":"bs-en-60191-6-202010-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60191-6-202010-2\/","title":{"rendered":"BS EN 60191-6-20:2010"},"content":{"rendered":"
This part of IEC 60191 specifies methods to measure package dimensions of small outline Jlead-packages (SOJ), package outline form E in accordance with IEC 60191-4.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
6<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Measuring methods <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | Figures Figure 1 \u2013 SOJ outline drawings <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | Figure 2 \u2013 Mounting height Figure 3 \u2013 Stand-off <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | Figure 4 \u2013 Body thickness A2 Figure 5 \u2013 Lead width and thickness <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Figure 6 \u2013 Measuring points of lead width and thickness Figure 7 \u2013 Soldered portion length Lp <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | Figure 8 \u2013 The allowable value t of Lp center <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Figure 9 \u2013 Positional tolerance of terminal <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Figure 10 \u2013 Positional tolerance of terminals <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)<\/b><\/p>\n |