ASTM-F1211:2001 Edition
$35.75
F1211-89(2001) Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)
| Published By | Publication Date | Number of Pages |
| ASTM | 2001 | 3 |
ASTM F1211-89-Reapproved2001
Withdrawn Standard: Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)
ASTM F1211
Scope
1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.
1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology.
1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified.
1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
Keywords
opening layouts; passivation; semiconductor devices
ICS Code
ICS Number Code 31.080.01 (Semi-conductor devices in general)
DOI: 10.1520/F1211-89R01
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