ASTM-F637 2001
$40.63
F637-85(2001) Standard Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices (Withdrawn 2006)
| Published By | Publication Date | Number of Pages |
| ASTM | 2001 | 7 |
ASTM F637-85-Reapproved2001
Withdrawn Standard: Standard Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices (Withdrawn 2006)
ASTM F637
Scope
1.1 This specification covers standard formats for testable semiconductor lead carrier tape suitable for hybrid applications.
1.2 This standard specifies tape width, configuration, and location of guide perforations (“sprocket holes”), location of lead pattern frames on tape, lead pattern window size, and placement of outer lead bond and electrical test pad areas in the lead pattern.
1.3 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.4 The following hazard caveat pertains only to the test method portion, Section 7 of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Keywords
lead carrier tape; 19-mm testable tape carrier; semiconductor devices; tape carrier bonding; 35-mm testable tape carrier
ICS Code
ICS Number Code 55.060 (Spools. Bobbins)
DOI: 10.1520/F0637-85R01
