BS EN 60068-2-83:2011
$167.15
Environmental testing – Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 42 |
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 12 | 1 Scope 2 Normative references 3 Terms and definitions |
| 13 | 4 Test 4.1 General description 4.2 Test methods 5 Preconditioning |
| 14 | 6 Preparation 6.1 Solder paste 6.2 Test jig plate 6.3 Specimen holder 7 Quick heating method 7.1 Equipment |
| 15 | 7.2 Test jig plate Figures Figure 1 – Examples of the quick heating method test equipment Tables Table 1 – Specification of the test jig plate for quick heating and synchronous method |
| 16 | 7.3 Preparation 7.4 Test condition Figure 2 – Example of test jig plate for quick heating and synchronous method |
| 17 | Figure 3 – Example of the temperature profile |
| 18 | 7.5 Test procedure Figure 4 – Example of applying solder paste to a test jig plate Table 2 – Recommended test conditions of the quick heatingand synchronous method for rectangular SMD |
| 19 | 7.6 Presentation of the result 7.7 Characterisation parameter examples Figure 5 – Typical output shape of signal in the quick heating method |
| 20 | 8 Synchronous method 8.1 Equipment Figure 6 – Example of synchronous method test equipment |
| 21 | 8.2 Test jig plate 8.3 Synchronous fixture 8.4 Preparation 8.5 Test condition 8.6 Test procedure Figure 7 – Example of synchronous fixture |
| 22 | 8.7 Presentation of the results Figure 8 – Typical output shape of signal in the synchronous method |
| 23 | 8.8 Characterisation parameter examples 9 Temperature profile method 9.1 Equipment 9.2 Test jig plate Figure 9 – Example of the system for temperature profile method test equipment |
| 24 | 9.3 Preparation 9.4 Test condition Figure 10 – Example of the temperature profile Table 3 – Specification of the test jig plate of the temperature profile method |
| 25 | 9.5 Test procedure Table 4 – Recommended test conditions of the temperatureprofile method for rectangular SMD |
| 26 | 9.6 Presentation of the result Figure 11 – Example of applying solder paste to a test jig plate |
| 27 | 9.7 Characterisation parameter examples Figure 12 – Typical output shape of signal in the temperature profile method |
| 28 | Annex A (normative) Equipment for the quick heating and synchronous method |
| 29 | Annex B (informative) Reading of the output data and correction of the result in the quick heating test |
| 30 | Figure B.1 – Typical wetting force changes in quick heating method |
| 31 | Figure B.2 – Example of correction of the initial time of wetting (Fa is larger than 0,5F1,max) Figure B.3 – Example of correction of the initial time of wetting (Fa is 0,5F1,max or less) |
| 32 | Annex C (normative) Test equipment for the temperature profile method |
| 33 | Annex D (informative) Reading of the output data and correction of the result in the temperature profile test |
| 34 | Figure D.1 – Typical output forms for profile temperature test |
| 35 | Figure D.2 – The case when an extruding force (1,1Fmax or larger)is generated immediately after the beginning of wetting |
| 36 | Annex E (informative) Caveats / Notes |
| 37 | Figure E.1 – Explanation diagram of test procedure for the quick heating method |
| 38 | Figure E.2 – Explanation diagram of test procedure for synchronous method Figure E.3 – Showing the wetting force (pull) of some solder pastes |
| 39 | Figure E.4 – Explanation diagram of the test procedure for the temperature profile method |
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IEC 60068-2-83:2011
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