BS EN 60191-6-3:2001
$102.76
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
| Published By | Publication Date | Number of Pages |
| BSI | 2001 | 20 |
| Status | Definitive |
|---|---|
| Pages | 20 |
| Publication Date | 2001-05-15 |
| ISBN | 0 580 37243 X |
| Standard Number | BS EN 60191-6-3:2001, IEC 60191-6-3:2001 |
| Title | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP) |
| Identical National Standard Of | IEC 60191-6-3:2000, EN 60191-6-3:2000 |
| Descriptors | Integrated circuits, Engineering drawings, Standardization, Semiconductor devices, Electronic equipment and components, Packages, Dimensions, Flat (shape), Drawings, Surface mounting devices |
| Publisher | BSI |
| Committee | EPL/47 |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
