BS EN 60749-14:2003

$102.76

Semiconductor devices. Mechanical and climatic test methods – Robustness of terminations (lead integrity)

Published By	Publication Date	Number of Pages
BSI	2003	18

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Additional information

Status	Under Review
Pages	18
Publication Date	2003-12-15
ISBN	0 580 43082 0
Partially Replaces	BS EN 60749:1999
Standard Number	BS EN 60749-14:2003
Title	Semiconductor devices. Mechanical and climatic test methods – Robustness of terminations (lead integrity)
Identical National Standard Of	IEC 60749-14:2003, EN 60749-14 (IEC 60749-14:2003) AS, EN 60068-2-13:1999
Descriptors	Testing conditions, Semiconductor devices, Torque, Qualification approval, Electronic equipment and components, Mechanical testing, Fatigue testing, Destructive testing, Tensile testing, Interfaces, Defects, Bend testing, Environmental testing, Climate, Semiconductors, Integrated circuits
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749-14:2003

$102.76


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