BS EN 60749-15:2003

$86.31

Semiconductor devices. Mechanical and climatic test methods – Resistance to soldering temperature for through-hole mounted devices

Published By	Publication Date	Number of Pages
BSI	2003	10

Guaranteed Safe Checkout

Categories: 31.080.01 - Semiconductor devices in general, BSI

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Additional information

Status	Withdrawn
Partially Replaces	BS EN 60749:1999
Title	Semiconductor devices. Mechanical and climatic test methods – Resistance to soldering temperature for through-hole mounted devices
Publisher	BSI
Committee	EPL/47
Pages	10
Publication Date	2003-06-19
Withdrawn Date	2011-02-28
Replaced By	BS EN 60749-15:2010, BS EN 60749-15:2010
ISBN	0 580 42061 2
Standard Number	BS EN 60749-15:2003
Identical National Standard Of	IEC 60749-15:2003, EN 60749-15:2003
Descriptors	Mechanical testing, Solderability testing, Climate, Slots, Destructive testing, Encapsulated, Electronic equipment and components, Holes, Integrated circuits, Semiconductor devices, Thermal testing, Soldering, Environmental testing
ICS Codes	31.080.01 - Semiconductor devices in general

Preview PDF

BS EN 60749-15:2003

$86.31


PDF Format	Searchable	Printable	Preview Now