BS EN 60749-16:2003:2004 Edition
$86.31
Semiconductor devices. Mechanical and climatic test methods – Particle impact noise detection (PIND)
Published By | Publication Date | Number of Pages |
BSI | 2004 | 10 |
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).