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BS EN 60749-3:2017

BS EN 60749-3:2017

$102.76

Semiconductor devices. Mechanical and climatic test methods – External visual examination

Published By Publication Date Number of Pages
BSI 2017 18
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The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 CONTENTS
8 FOREWORD
10 1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
11 6 Failure criteria
7 Summary
12 Annex A (informative) External visual report form/checklist (example only ā€“ not a mandatory template)
A.1 Leads
13 A.2 Lead finish
A.3 Moulding and mould compound
14 A.4 Critical sealant
A.5 Attachments
A.6 Marking
15 A.7 Solder Balls
A.8 Substrate
A.9 Exposed (Backside) Silicon
16 Bibliography

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BS EN 60749-3:2017
$102.76