BS EN 60749-4:2017
$102.76
Semiconductor devices. Mechanical and climatic test methods – Damp heat, steady state, highly accelerated stress test (HAST)
| Published By | Publication Date | Number of Pages |
| BSI | 2017 | 16 |
This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | National foreword |
| 5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
| 7 | CONTENTS |
| 8 | FOREWORD |
| 10 | 1 Scope 2 Normative references 3 Terms and definitions 4 HAST test – General remarks |
| 11 | 5 Test apparatus 5.1 Test apparatus requirements 5.2 Controlled conditions 5.3 Temperature profile 5.4 Devices under stress 5.5 Minimize release of contamination 5.6 Ionic contamination 5.7 De-ionized water 6 Test conditions 6.1 Test conditions requirements |
| 12 | 6.2 Biasing guidelines Table 1 – Temperature, relative humidity and duration requirements |
| 13 | 6.3 Choosing and reporting 7 Procedure 7.1 Test device mounting 7.2 Ramp-up 7.3 Ramp-down 7.4 Test clock 7.5 Bias Table 2 – Bias and reporting requirements |
| 14 | 7.6 Readout 7.7 Handling 7.8 Calibration records 8 Failure criteria 9 Safety 10 Summary |
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BS EN 60749-4:2017
Semiconductor devices. Mechanical and climatic test methods – Damp heat, steady state, highly accelerated stress…
