BS EN 61182-2-2:2012

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Printed board assembly products. Manufacturing description data and transfer methodology – Sectional requirements for implementation of printed board fabrication data description

Published By	Publication Date	Number of Pages
BSI	2012	48

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Description

This part of IEC 61182 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2.

The IEC 61182-2 contains all the requirements necessary to build an electronic product. The cardinality indicated in the IEC 61182-2 may be superseded by a restriction of an attribute (enumerated string ID) or indication of a requirement that is noted as being optional in the generic standard. However, this standard renders the requirement mandatory based on the supply chain communication need.

In order to assist the users of this standard, all the applicable XML schema elements that apply to the board fabrication function are listed in Annex A. The list is grouped by topics and shows the absolute path for the elements that pertain to the focus of this standard. If the parent element is not present no children are considered in the implementation either. However, all attributes identified for a particular element follow the cardinality of the IEC 61182-2, unless a restriction is stated in this standard.

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PDF Pages	PDF Title
6	English CONTENTS
8	1 Scope 2 Normative references 3 Terms and definitions
9	4 General principles 4.1 Requirements 4.2 Interpretation
10	4.3 Categories and content Tables Table 1 – Function relationship of an IEC 61182-2-2 fabrication file
11	5 General rules 5.1 Overview Figures Figure 1 – Board fabrication data relationship
12	5.2 File content descriptions 5.3 Logistic descriptions 5.4 File history descriptions 5.4.1 General
13	5.4.2 HistoryRecord use case – Initial design release Figure 2 – HistoryRecord use case
14	5.4.3 Supply chain modifications
16	5.4.4 OEM reviews modifications – HistoryRecord update 5.5 BOM (board fabrication materials)
17	Table 2 – Bom restrictions Table 3 – Recommended reference designators for printed board material
18	5.6 AVL (board material suppliers) 5.7 Documentation layers 5.7.1 General 5.7.2 Documentation layer restrictions Table 4 – Avl restrictions
19	5.7.3 Reference to documentation Table 5 – Documentation layer restrictions Table 6 – General descriptions of documentation layer functions
20	5.7.4 Step usage Figure 3 – Documentation package grade requirements Table 7 – Relationship to documentation standard
21	5.7.5 Set 5.8 Design for excellence (Dfx) analysis 5.8.1 General 5.8.2 DfxMeasurement 5.9 Miscellaneous image layers 5.9.1 General
22	5.9.2 Step usage 5.10 Packages and land patterns 5.10.1 General 5.10.2 Step usage for component packages and land patterns Table 8 – Miscellaneous layer restrictions
23	5.10.3 Land pattern details 5.11 Solder mask and legend layers 5.11.1 General 5.11.2 Solder mask details 5.11.3 Legend details
24	5.11.4 Step usage for solder mask and legend layers 5.12 Drilling and routing (tooling) layers 5.12.1 General 5.12.2 Drilling details 5.12.3 Routing details
25	5.12.4 Step usage for drilling and routing 5.13 Net list 5.13.1 General
26	5.13.2 Step usage for net list 5.14 Outer conductive layers 5.14.1 General 5.14.2 Outer conductive layer details 5.14.3 Step usage for outer conductive layers
27	5.15 Inner conductive layers 5.15.1 Requirement 5.15.2 Inner conductive layer details 5.15.3 Step usage for inner conductive layers 5.16 Board construction 5.16.1 Requirement
28	5.16.2 Board construction details 5.16.3 Step usage for board construction 6 Modeling 6.1 General
29	6.2 Information models Figure 4 – Fabrication steps data model example
30	7 Report generators 7.1 IEC 61182-2-2 format Figure 5 – IPC-2584 UML data model
31	7.2 Hole usage report 7.3 Pad usage report 7.4 Conductor usage report 8 Glossary
32	Annex A (normative) Printed board fabrication schema
44	Bibliography

Additional information

Status	Definitive
Pages	48
Publication Date	2012-08-31
ISBN	978 0 580 70189 4
Standard Number	BS EN 61182-2-2:2012
Title	Printed board assembly products. Manufacturing description data and transfer methodology – Sectional requirements for implementation of printed board fabrication data description
Identical National Standard Of	EN 61182-2-2:2012, IEC 61182-2-2:2012
Descriptors	Electrical resistivity, Printed circuits, Data transfer, Data representation, Data processing, Thickness, Printed-circuit boards, Data organization, Electrical testing, Production, Design, Dimensional tolerances, Information exchange, Assembling, Electronic equipment and components, Printed-circuit bases
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BS EN 61182-2-2:2012

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