BS EN 61189-5-2:2015

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. Soldering flux for printed board assemblies

Published By	Publication Date	Number of Pages
BSI	2015	46

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Description

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering flux for lead free soldering.

Additional information

Status	Definitive
Pages	46
Publication Date	2015-04-30
ISBN	978 0 580 90018 1
Standard Number	BS EN 61189-5-2:2015
Title	Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. Soldering flux for printed board assemblies
Identical National Standard Of	EN 61189-5-2:2015
Corrects	BS IEC 61189-5-2:2015
Descriptors	Soldering, Visual inspection (testing), Electrical insulating materials, Chemical analysis and testing, Mechanical testing, Dimensional measurement, Environmental testing, Electronic equipment and components, Printed-circuit boards, Fluxes (materials), Printed circuits, Electrical testing
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BS EN 61189-5-2:2015

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