BS EN 61190-1-2:2002

$102.76

Attachment materials for electronic assembly – Requirements for solder pastes for high-quality interconnections in electronic assembly

Published By	Publication Date	Number of Pages
BSI	2002	22

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Description

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Additional information

Status	Withdrawn
Title	Attachment materials for electronic assembly – Requirements for solder pastes for high-quality interconnections in electronic assembly
Publisher	BSI
Committee	EPL/501
Pages	22
Publication Date	2002-08-12
Withdrawn Date	2007-07-31
Replaced By	BS EN 61190-1-2:2007
ISBN	0 580 40233 9
Standard Number	BS EN 61190-1-2:2002
Identical National Standard Of	IEC 61190-1-2:2002, EN 61190-1-2:2002
Descriptors	Electronic equipment and components, Soldering, Soldered connectors, Solders, Electronic engineering, Quality assurance, Bonding, Quality control, Electrical connections, Pastes, Classification systems
ICS Codes	31.190 - Electronic component assemblies

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BS EN 61190-1-2:2002

$102.76


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