BS EN 62047-12:2011
$167.15
Semiconductor devices. Micro-electromechanical devices – Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 34 |
This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 µm to 1 000 µm in the plane direction and from 1 µm to 100 µm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 µm and 10 µm in thickness.
The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 8 | 1 Scope 2 Normative references 3 Terms and definitions |
| 9 | 4 Test equipment 4.1 General Figures Figure 1 – Block diagram of the test method |
| 10 | 4.2 Actuator 4.3 Sensor 4.4 Controller |
| 11 | 4.5 Recorder 4.6 Parallel testing 5 Specimen 5.1 General 5.2 Resonant properties 5.3 Test part 5.4 Specimen fabrication 6 Test conditions 6.1 Test amplitude |
| 12 | 6.2 Load ratio 6.3 Vibration frequency 6.4 Waveform 6.5 Test time 6.6 Test environment 7 Initial measurement 7.1 Reference strength measurement |
| 13 | 7.2 Frequency response test 8 Test 8.1 General 8.2 Initial load application |
| 14 | 8.3 Monitoring 8.4 Counting the number of cycles 8.5 End of the test 8.6 Recorded data 9 Test report |
| 16 | Annex A (informative) Example of testing using an electrostatic device with an integrated actuation component and displacement detection component Figure A.1 – Microscope image of the specimen |
| 17 | Figure A.2 – Block diagram of test equipment |
| 19 | Annex B (informative) Example of testing using an external drive and a devicewith an integrated strain gauge for detecting displacement Figure B.1 – The specimens’ structure |
| 20 | Figure B.2 – Block diagram of test equipment |
| 22 | Annex C (informative) Example of electromagnetic drive out-of-plane vibration test (external drive vibration test) Figure C.1 – Specimen for out-of-plane vibration testing |
| 23 | Figure C.2 – Block diagram of test equipment |
| 25 | Annex D (informative) Theoretical expression on fatigue life of brittle materials basedon Paris’ law and Weibull distribution |
| 29 | Annex E (informative) Analysis examples Figure E.1 – Example of fatigue test results for silicon materials |
| 30 | Figure E.2 – Static strength and fatigue life of polysilicon plotted in 3D |
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BS EN 62047-12:2011
Semiconductor devices. Micro-electromechanical devices – Bending fatigue testing method of thin film materials using resonant…
