BS EN 62047-17:2015
$167.15
Semiconductor devices. Micro-electromechanical devices – Bulge test method for measuring mechanical properties of thin films
Published By | Publication Date | Number of Pages |
BSI | 2015 | 34 |
IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 ? to 10 ?, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.
PDF Catalog
PDF Pages | PDF Title |
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6 | English CONTENTS |
8 | FOREWORD |
10 | 1 Scope 2 Normative references 3 Terms, definitions and symbols 3.1 Terms and definitions |
11 | 3.2 Symbols 4 Principle of bulge test Figures Figure 1 – Typical example of bulge specimen Tables Table 1 – Symbols and designations of a specimen |
12 | 5 Test apparatus and environment 5.1 General Figure 2 – Membrane window bulged by pressure Figure 3 – Typical example of bulge test apparatus |
13 | 5.2 Apparatus 5.2.1 Pressuring device 5.2.2 Bulge (pressure) chamber 5.2.3 Height measurement units |
14 | 5.3 Test environment 6 Specimen 6.1 General 6.2 Shape and dimension of specimen 6.3 Measurement of test piece dimension Figure 4 – Bulge membrane window shapes |
15 | 7 Test procedure and analysis 7.1 Test procedure |
16 | 7.2 Data analysis Figure 5 – Example of typical pressure-height curve obtained from bulge test |
17 | 8 Test report |
18 | Annex A (informative) Determination of mechanical properties A.1 General A.2 Determination of mechanical properties using stress-strain curve |
20 | A.3 Determination of mechanical properties using analysis of load-deflection |
21 | Table A.1 – Examples of various expressions of parameters, C1 and C2(ν), for thin square films Table A.2 – Examples of various expressions of parameters, C1 and C2(ν), for thin spherical films |
22 | Figure A.1 – Determination of biaxial modulus in the stress-strain curve obtained from bulge test |
23 | Annex B (informative) Deformation measurement techniques B.1 General B.2 Laser interferometry technique B.3 Capacitance type measurement |
25 | Figure B.1 – Typical example of laser interferometer configuration |
26 | Figure B.2 – Typical fringe patterns obtained from laser Michelson interferometry and ESPI system |
27 | Figure B.3 – Typical example of the measurement system using a photo detector Figure B.4 – Schematic of capacitance bulge tester |
28 | Figure B.5 – Typical example of relationshipbetween bulge height and capacitance change |
29 | Annex C (informative) Example of test piece fabrication: MEMS process C.1 Test piece fabrication Figure C.1 – Example of fabrication procedure for bulge test piece |
30 | C.2 Measurement of shape of specimen |
31 | Bibliography |