BS EN 62258-1:2010
$189.07
Semiconductor die products – Procurement and use
| Published By | Publication Date | Number of Pages |
| BSI | 2010 | 48 |
IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached connection structures, – minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including: – product identity, – product data, – die mechanical information, – test, quality, assembly and reliability information, – handling, shipping and storage information. The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 9 | INTRODUCTION |
| 10 | 1 Scope 2 Normative references |
| 11 | 3 Terms and definitions 3.1 Basic definitions |
| 12 | 3.2 General terminology |
| 14 | 3.3 Semiconductor manufacturing and interconnection terminology |
| 15 | 4 General requirements 5 Data exchange |
| 16 | 6 Requirements for all devices 6.1 Data package 6.2 Identity and source 6.3 Function |
| 17 | 6.4 Physical characteristics 6.5 Ratings and limiting conditions 6.6 Connectivity |
| 18 | 6.7 Documentation 6.8 Form of supply 6.9 Simulation and modelling |
| 19 | 7 Requirements for bare die and wafers with or without connection structures 7.1 General 7.2 Identity 7.3 Materials |
| 20 | 7.4 Geometry |
| 21 | 7.5 Wafer data 8 Minimally-packaged devices 8.1 General 8.2 Number of terminals 8.3 Terminal position |
| 22 | 8.4 Terminal shape and size 8.5 Device size 8.6 Seated height 8.7 Encapsulation material 8.8 Moisture sensitivity 8.9 Package style code 8.10 Outline drawing |
| 23 | 9 Quality, test and reliability 9.1 General 9.2 Outgoing quality level 9.3 Electrical parameters specified 9.4 Compliance to standards 9.5 Additional device screening 9.6 Product status 9.7 Testability features 9.8 Additional test requirements |
| 24 | 9.9 Reliability 10 Handling and packing 10.1 General requirements for all devices |
| 25 | 10.2 Specific requirement for bare die or wafers – mask version 10.3 Specific requirement for wafers – wafer map 10.4 Special item requirements |
| 26 | 11 Storage 11.1 General 11.2 Storage duration and conditions 11.3 Long-term storage 11.4 Storage limitations |
| 27 | 12 Assembly 12.1 General 12.2 Attach methods and materials 12.3 Bonding method and materials 12.4 Attachment limitations 12.5 Process limitations |
| 28 | Annex A (informative) Terminology |
| 38 | Annex B (informative) Acronyms |
| 45 | Bibliography |
