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BS EN IEC 60068-2-21:2021

BS EN IEC 60068-2-21:2021

$189.07

Environmental testing – Tests. Test U: Robustness of terminations and integral mounting devices

Published By Publication Date Number of Pages
BSI 2021 50
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This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations and is also applicable to surface mount devices (SMDs).

The recommended test methods suitable for specific terminations/lead of devices are shown in Table 1.

Table 1 – Selection of test methods suitable for specific terminations/leads

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
10 FOREWORD
12 1 Scope
2 Normative references
Tables
Table 1 – Selection of test methods suitable for specific terminations/leads
13 3 Terms and definitions
4 Tests Ua: Robustness of terminals against axial stresses
4.1 Object
4.2 Application
4.3 General description
4.4 Preconditioning
4.5 Initial measurements
14 4.6 Test procedures
4.6.1 Test Ua1: Tensile
Figures
Figure 1 – Direction of the applied pull force Fp in test Ua1
15 4.6.2 Test Ua2: Thrust
Figure 2 – Direction of the applied thrust Ft in test Ua2
Table 2 – Value of applied pull force for test Ua1
16 4.7 Final measurements
4.8 Information to be given in the relevant specification
5 Tests Ub: Robustness of terminals against bending stresses
5.1 Object
Table 3 – Value of applied thrust for test Ua2
17 5.2 Application
5.2.1 General
5.2.2 Pliable terminations
5.2.3 Rigid and all other terminations
Figure 3 – Displacement of pliable lead wires in test Ub
18 5.3 General description
Figure 4 – Bending force applied to a specimen with non-pliable terminations
Table 4 – Value of applied force for test Ub
19 5.4 Preconditioning
5.5 Initial measurements
5.6 Test procedures
5.6.1 Test Ub1 (for wire and strip terminations)
20 Figure 5 – Sequential test procedure of test Ub, Method 1
21 5.6.2 Test Ub2 (for tag terminations)
Figure 6 – Sequential test procedure of test Ub, Methods 2 and 3
22 5.6.3 Test Ub3 Simultaneous bending
5.7 Final measurements
5.8 Information to be given in the relevant specification
Figure 7 – Clamp for the testing of short terminations
23 6 Test Uc: Torsion
6.1 Object
6.2 Application
6.3 General description
6.4 Preparation of the specimen
6.5 Initial measurements
Figure 8 – Preparatory bending of a lead wire for test Uc
24 6.6 Test procedure
Figure 9 – Torsion test method 1: Rotation of clamped specimen body
25 6.7 Final measurements
6.8 Information to be given in the relevant specification
7 Test Ud: Torque
7.1 Object
7.2 Application
Figure 10 – Torsion test method 2: Rotation of clamped other lead wire
26 7.3 General description
7.4 Preconditioning
7.5 Initial measurements
7.6 Test procedure
7.6.1 Terminations with threaded studs or screws
Table 5 – Torque severity
27 Figure 11 – Assembly for the torque test applied to a threaded stud
Figure 12 – Preparation of a threaded termination for the torque test
28 7.6.2 Other test configurations
7.7 Final measurements
7.8 Information to be given in the relevant specification
Figure 13 – Assembly for the torque test applied to an embedded nut
29 8 Test Ue: Robustness of terminations for SMD in the mounted state
8.1 Object
8.2 Application
8.3 Substrate for test method Ue
30 Figure 14 – Example of substrate for test method Ue
31 8.4 Mounting
8.4.1 Dimensions
8.4.2 Possible mounting methods
8.4.3 Mounting method for substrate bending, pull-off, push-off and shear
32 8.5 Preconditioning
8.6 Initial measurements
8.7 Test methods
8.7.1 Test Ue1: Substrate bending test
33 8.7.2 Test Ue2: Pull-off and push-off test
Figure 15 – Substrate bending test
34 Figure 16 – Test Ue2, pull-off test
35 8.7.3 Test Ue3: Shear test
Figure 17 – Test Ue2, push-off test
36 Figure 18 – Test Ue3, shear test
37 8.8 Final measurements
8.8.1 Recovery
8.8.2 Visual examination of terminations
8.8.3 Electrical characteristics
8.8.4 Hidden defect
8.9 Information to be given in the relevant specification
39 9 Test Uf: Robustness of component body
9.1 Object
9.2 Application
9.3 General description
9.4 Preconditioning
9.5 Initial measurement
9.6 Test procedure
9.6.1 Test Uf1: Body strength
40 Figure 19 – SMD Body strength test Uf1 applied to a rectangular specimen
41 9.6.2 Test Uf2: Impact shock
Figure 20 – SMD Body strength test Uf1 applied to a MELF specimen
42 Figure 21 – Example of an apparatus for test Uf2
Figure 22 – Example of a piston
43 9.7 Final measurements
9.7.1 Recovery
Figure 23 – Examples of the application of the SMD Body impact shock test Uf2
44 9.7.2 Visual examination
9.7.3 Electrical characteristics
9.7.4 Hidden defect
9.8 Information to be given in the relevant specification
45 Annex X (informative)Cross-reference for references tothe previous editions of this document
X.1 Cross-reference for references to the previous edition of IEC 60068‑2‑21
Table X.1 – Cross-reference to clauses
46 X.2 Cross-reference for references to the last edition of IEC 60068‑2‑77
Table X.2 – Cross-reference to figures
Table X.3 – Cross reference to tables
47 Table X.4 – Cross-reference to clauses
Table X.5 – Cross-reference to figures
48 Bibliography

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