BS EN IEC 60115-1:2023 – TC
$280.87
Tracked Changes. Fixed resistors for use in electronic equipment – Generic specification
| Published By | Publication Date | Number of Pages |
| BSI | 2023 | 412 |
IEC 60115-1:2020 is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.This edition contains the following significant technical changes with respect to the previous edition:
- this 5th edition employs a new document structure, where the tests of prior Clause 4 are given in Clauses 6 to 12 now, with an informative Annex X providing cross-references for references to the prior revision of this standard;
- the terms and definitions have been revised and amended, supplemented by a new section on resistor technologies and a new section on product classification levels;
- a new Subclause 4.7 on recommendations for permissible substitutions has been added;
- the provisions for packaging, storage and transportation in Subclauses 4.8, 4.9 and 4.10 have been completely revised;
- a new Subclause 5.3 on default tolerances for the most common test parameters has been added;
- the generic method of measuring resistance, now Sublause 5.6, has been separated from the test for compliance with a prescribed resistance value in 6.1, as a revision of the prior 4.5;
- the test for the temperature coefficient of resistance of Subclause 6.2 is a revision of the prior test 4.8, variation of resistance with temperature, where the special concessions for resistors below 10 ? have been waived;
- the test methods for endurance testing of Subclauses 7.1 to 7.3 (prior 4.25.1 to 4.25.3) have been completely revised;
- the single?pulse high?voltage overload test of Subclause 8.2 (prior 4.27) has been completely revised, and now offers adjustable severities for the 1,2/50 and for the 10/700 pulse shape for the benefit of detail specifications with improved significance;
- the periodic-pulse high-voltage overload test of Subclause 8.3 (prior 4.28) has been revised and a corrected table of severities provided;
- the period-pulse overload test of Subclause 8.4 (prior 4.39) has been deprecated and streamlined to only offer the severity historically applied in subordinate specifications;
- the Subclauses 9.1 on visual inspection, 9.2 on the gauging of dimensions, and 9.3 on the assessment of detail dimensions (all parts of prior 4.4) have been completely revised;
- the tests for robustness of terminations (prior 4.16) have been revised and separated into tests for the robustness of solderable terminations, Subclause 9.5, and tests for the robustness of threaded stud or screw terminations, Subclause 9.6;
- the bump test of Subclause 9.9 (prior 4.20) and the shock test of Subclause 9.10 (prior 4.21) have been revised to reflect the merged relevant test standard IEC 60068-2-29;
- the dry heat and cold test of the climatic sequence of Subclause 10.3 (prior 4.23) have been revised to reflect the changes of the relevant test standards IEC 60068?2?2 and IEC 60068?2?1;
- the accelerated damp heat, steady state test of Subclause 10.5 (prior 4.37) has been amended with an option for a reduced number of bias voltages;
- the corrosion test of Subclause 10.6 has been completely revised in order to employ the better suitable test method of IEC 60068-2-52 instead of the prior used IEC 60068-2-11;
- the whisker growth test of Subclause 10.7 has been revised to reflect the changes of the new revision of the test methods of IEC 60068-2-82;
- the test methods for solderability of Subclause 11.1 (prior 4.17) and for resistance to soldering heat of Subclause 11.2 (prior 4.18) have been completely revised to incorporate the necessary option for the variety of lead-bearing and lead-free solder alloys and respective process conditions;
- the solvent resistance test of Subclause 11.3 combines the prior tests 4.29, component solvent resistance, and 4.30, solvent resistance of marking, in one test;
- the accidental overload test of Subclause 12.3 (prior 4.26) has been completely revised;
- the Annex Q on quality assessment procedures has been completely revised;
- a new Annex R on failure rate evaluation, determination and qualification has been added.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 248 | undefined |
| 250 | European foreword |
| 252 | 11 Addition of Annex ZA |
| 255 | 12 Addition of a new Annex ZX Table ZX.1 โ Cross-references for references to clauses |
| 257 | Table ZX.2 โ Cross-references for references to figures |
| 258 | Table ZX.3 โ Cross reference for references to tables |
| 259 | English CONTENTS |
| 263 | FOREWORD |
| 266 | INTRODUCTION |
| 267 | Figures Figure 1 โ Hierarchical system of specifications |
| 268 | 1 Scope 2 Normative references |
| 270 | 3 Terms, definitions, product technologies and product classifications 3.1 Terms and definitions |
| 271 | Figure 2 โ Voltage and dissipation on a resistor below and above its critical resistance |
| 277 | 3.2 Product technologies |
| 280 | 3.3 Resistor encapsulations |
| 281 | 3.4 Product classification |
| 282 | 4 General requirements 4.1 Units and symbols 4.2 Preferred values |
| 283 | 4.3 Coding 4.4 Marking of the resistors 4.5 Marking of the packaging |
| 284 | 4.6 Ordering designation 4.7 Permissible substitutions |
| 285 | 4.8 Packaging |
| 286 | 4.9 Storage 4.10 Transportation |
| 287 | 5 General provisions for measurements and test methods 5.1 General 5.2 Standard atmospheric conditions Tables Table 1 โ Reference atmospheric conditions |
| 288 | Table 2 โ Referee atmospheric conditions Table 3 โ Standard atmospheric conditions for testing |
| 289 | 5.3 Tolerances on test severity parameters Table 4 โ Controlled atmospheric conditions for recovery Table 5 โ Default tolerances on temperature specifications Table 6 โ Default tolerances on voltage specifications |
| 290 | 5.4 Drying 5.5 Mounting of specimens Table 7 โ Default tolerances on duration specifications Table 8 โ Specimen drying procedures |
| 292 | 5.6 Measurement of resistance Table 9 โ Voltages for resistance measurement |
| 293 | Figure 3 โ Standard measurement points on a leaded resistor Figure 4 โ Standard measurement points on an SMD resistor |
| 294 | 6 Electrical measurements and tests 6.1 Resistance Figure 5 โ Measurement points on an assembled SMD resistor |
| 295 | Figure 6 โ Permissible resistance range due to tolerance |
| 296 | 6.2 Temperature coefficient of resistance Figure 7 โ Permissible resistance range due to tolerance and TCR Figure 8 โ Variation of resistance with temperature (example) |
| 297 | Table 10 โ Sequence of temperatures and measurements |
| 299 | 6.3 Inductance |
| 300 | Figure 9 โ Test circuit for measurement of the inductance |
| 301 | 6.4 Voltage coefficient of resistance Figure 10 โ Exponential voltage rise caused by inductance |
| 302 | 6.5 Nonlinearity |
| 303 | 6.6 Current noise |
| 304 | 6.7 Temperature rise |
| 305 | 7 Endurance tests 7.1 Endurance at the rated temperature 70 ยฐC |
| 306 | Figure 11 โ Standard derating curve for the rated dissipation P70 |
| 307 | 7.2 Endurance at room temperature |
| 310 | Figure 12 โ Derating curve with specification of a suitable test dissipation Figure 13 โ Derating curve without specification of a suitable test dissipation |
| 312 | 7.3 Endurance at a maximum temperature |
| 314 | Figure 14 โ Derating curve for UCT โฅ MET Figure 15 โ Derating curve for UCT < MET |
| 316 | 8 Electrical overload tests 8.1 Short-term overload |
| 318 | 8.2 Single-pulse high-voltage overload test |
| 319 | Figure 16 โ Parameters of an open-circuit lightning impulse voltage |
| 320 | Figure 17 โ Circuit for generation of 1,2/50 pulses |
| 321 | Figure 18 โ Circuit for generation of 10/700 pulses |
| 322 | Table 11 โ Severities for the single-pulse high-voltage overload test |
| 323 | 8.3 Periodic-pulse high-voltage overload test |
| 325 | 8.4 Periodic-pulse overload test Table 12 โ Severities for the periodic-pulse high-voltage overload test |
| 327 | 8.5 Electrostatic discharge |
| 328 | 9 Mechanical measurements and tests 9.1 Visual examination |
| 329 | 9.2 Gauging of dimensions |
| 330 | 9.3 Detail dimensions |
| 331 | 9.4 Robustness of the resistor body |
| 332 | 9.5 Robustness of terminations Figure 19 โ Testing of resistor body robustness |
| 333 | Table 13 โ Tensile test force for wire terminations |
| 335 | 9.6 Robustness of threaded stud or screw terminations Table 14 โ Test torque for threaded studs, screws and integral mounting devices |
| 336 | 9.7 Shear test |
| 337 | Figure 20 โ Shear test for SMD resistors |
| 338 | 9.8 Substrate bending test Table 15 โ Recommended parameters for the substrate bending test |
| 339 | Figure 21 โ Substrate bending test for SMD resistors |
| 340 | 9.9 Bump |
| 341 | 9.10 Shock Table 16 โ Recommended parameters for the bump test |
| 342 | 9.11 Vibration Table 17 โ Recommended parameters for the shock test |
| 343 | Table 18 โ Recommended parameters for the vibration test |
| 344 | 10 Environmental and climatic tests 10.1 Rapid change of temperature |
| 345 | 10.2 Operation at low temperature Table 19 โ Recommended parameters for the rapid change of temperature test |
| 346 | 10.3 Climatic sequence |
| 348 | Table 20 โ Number of additional damp heat cycles |
| 349 | 10.4 Damp heat, steady state |
| 350 | Table 21 โ Severity parameters for the damp heat, steady state test |
| 351 | Table 22 โ Bias voltage for the damp heat, steady state test |
| 352 | 10.5 Damp heat, steady state, accelerated |
| 353 | Table 23 โ Severity parameters for the accelerated damp heat, steady state test |
| 354 | 10.6 Corrosion Table 24 โ Grouped DC bias voltages for < 25 % deviation |
| 355 | Table 25 โ Recommended parameters for the corrosion test |
| 356 | 10.7 Whisker growth test |
| 357 | 10.8 Hydrogen sulphide test Table 26 โ Test methods and parameters for the whisker growth test |
| 358 | 11 Tests related to component assembly 11.1 Solderability Table 27 โ Selection of accelerated ageing methods of IEC 60068-2-20 |
| 359 | Table 28 โ Process temperatures for selected solder alloy examples |
| 360 | Table 29 โ Solderability test parameters for SMD resistors |
| 361 | Table 30 โ Solderability test parameters for resistors with wire or tag terminations |
| 362 | 11.2 Resistance to soldering heat |
| 363 | Table 31 โ Resistance to soldering heat test parameters for SMD resistors Table 32 โ RSH test parameters for resistors with wire or tag terminations |
| 364 | 11.3 Solvent resistance |
| 366 | 12 Tests related to safety 12.1 Insulation resistance Table 33 โ Recommended parameters for the solvent resistance test |
| 367 | Figure 22 โ V-block fixture |
| 368 | Figure 23 โ Foil method applied to a resistor specimen Figure 24 โ Mounting method applied to a resistor specimen |
| 369 | Figure 25 โ Parallel clamp fixture for rectangular SMD resistors |
| 370 | Figure 26 โ V-clamp test fixture for cylindrical SMD resistors |
| 371 | 12.2 Voltage proof Table 34 โ Insulation resistance measuring voltage |
| 372 | 12.3 Accidental overload test |
| 374 | Figure 27 โ Gauze fixture for axial cylindrical specimens |
| 375 | Figure 28 โ Gauze fixture dimensions for cylindrical specimens |
| 376 | Figure 29 โ Gauze fixture dimensions for non-cylindrical specimens |
| 377 | 12.4 Flammability Table 35 โ Recommended parameters for the accidental overload test |
| 378 | 13 Quality assessment procedures |
| 380 | Annexes Annex A (normative) Symbols and abbreviated terms |
| 386 | Annex B (normative) Rules for the preparation of detail specifications for resistors and capacitors for electronic equipment for use within the IECQ system |
| 387 | Annex C (informative) Example of a certified test record |
| 389 | Annex Q (informative) Quality assessment procedures Q.1 General |
| 393 | Q.2 IECQ Approved Component (IECQ AC) procedures |
| 394 | Q.3 IECQ Qualification Approval (QA) procedures |
| 395 | Q.4 IECQ Approved Component โ Capability Certification (IECQ AC-C) procedures |
| 397 | Q.5 IECQ Approved Component โ Technology Certification (IECQ AC-TC) procedure |
| 400 | Annex R (informative) Failure rate level evaluation, determination and qualification R.1 General |
| 401 | R.2 Certification and determination of a failure rate level |
| 402 | Table R.1 โ Requirements for the qualification of a failure rate level |
| 403 | R.3 Non-conformances R.4 Extension of a qualification to a higher failure rate level R.5 Maintenance of a failure rate level |
| 404 | R.6 Deliveries Table R.2 โ Requirements for the maintenance of a failure rate level qualification |
| 405 | R.7 Determination of a component failure rate |
| 407 | Table R.3 โ Environmental factor ฯE for determination of the component failure rate Table R.4 โ Quality factor ฯQ for determination of the component failure rate |
| 408 | Annex X (informative)Cross-references for references to the prior revision of this document Table X.1 โ Cross-references for references to clauses (1 of 3) |
| 409 | Bibliography |
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