BS EN IEC 60286-5:2018
$167.15
Packaging of components for automatic handling – Matrix trays
| Published By | Publication Date | Number of Pages |
| BSI | 2018 | 40 |
IEC 60286-5:2018 is available as /2 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60286-5:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60286-5:2018 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions that are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays. This edition includes the following significant technical changes with respect to the previous edition: – The generic rules for the design of matrix trays are given in this document. Newly developed trays which follow these rules will not be listed individually. Only those trays which conform to the design rules set forth herein are classified as “standard trays” and are thus preferred for use. – An update of the matrix trays, which do not conform to the design rules set forth herein, are considered as “non-standard trays” and are not preferred for use, is listed in Annex A.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 5 | CONTENTS |
| 8 | FOREWORD |
| 10 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions 3.2 Abbreviated terms |
| 11 | 4 Material 4.1 Electrostatic dissipative requirements 4.2 Effect of properties 4.3 Recycling and rigidity 5 Mechanical stability 5.1 Loaded tray 5.2 Empty tray 5.3 Outer edges 6 Tray design, dimensions and other physical properties 6.1 Tray design 6.1.1 Number of pockets 6.1.2 Orientation of pockets |
| 12 | 6.1.3 Design rules for pocket density Tables Table 1 – P and W dimension |
| 13 | 6.2 Overall tray dimensions 6.3 Cell dimensions Table 2 – Height dimensions |
| 14 | 6.4 Tray vacuum pick-up sites 6.4.1 Size 6.4.2 Centre 6.4.3 Perimeter 6.5 Detail features Figures Figure 1 – Sample of leaded packages Figure 2 – Sample of grid array packages |
| 15 | 6.6 Weight 6.7 Movement of components 6.8 Dimensional information |
| 16 | Figure 3 – Tray main view |
| 17 | Figure 4 – Tray stacking details Figure 5 – Tray tolerances |
| 18 | 7 Polarity and orientation of components in the tray 7.1 Pin one 7.2 Loading 8 Tray stacking 8.1 Bundling Table 3 – Notes related to Figures 3 and 4 |
| 19 | 8.2 Top protection 8.3 Partial filling 8.4 Protrusion of components 8.5 Stack-up 8.6 Damaging of components 8.7 Warpage 9 Missing components 10 Marking |
| 20 | Annex A (informative) List of existing matrix trays with wide anticipated use in the electronic industries A.1 Matrix trays (for different packages) |
| 21 | Figure A.1 – Thin tray |
| 22 | Table A.1 – Variations |
| 28 | A.2 Matrix trays for PGA packages A.2.1 Dimensional information |
| 29 | Figure A.2 – Thick matrix |
| 30 | Table A.2 – Notes related to Figures A.1 and A.2 |
| 31 | A.2.2 Variation sheet PGA (pin grid array package) Table A.3 – PGA variations |
| 32 | Annex B (normative) Measurement methodology of the tray dimensions B.1 General B.2 Definition of the dimensions B.2.1 Outline dimensions |
| 33 | B.2.2 Tray thickness (A) Figure B.1 – Cross-sections of the outline dimensions Figure B.2 – Tray thickness |
| 34 | B.2.3 Dimensions of the stacking feature B.2.4 Warpage B.3 Measuring instrument B.4 Measurement conditions B.5 Measurement methodology B.5.1 Outline dimensions Figure B.3 – Examples of tray warpage |
| 35 | B.5.2 Tray thickness (A) Figure B.4 – Top view of a tray showing the measurement locations for the outline dimensions Figure B.5 – Measurement locations for tray thickness Figure B.6 – Holding position in calliper jaws for measurement Figure B.7 – Correction of a lift of the tray at the measurement point |
| 36 | B.5.3 Dimensions of the stacking feature B.5.4 Warpage Figure B.8 – Measurement locations for the stackable design Figure B.9 – Measurement points for warpage |
| 37 | Annex C (normative) Matrix trays – General considerations for design (design value) C.1 Lateral movement of leaded devices C.2 Lateral movement of un-leaded devices Figure C.1 – Lateral movement of leaded devices A to I Figure C.2 – Lateral movement of un-leaded devices check points A to C |
| 38 | C.3 Lead protection Figure C.3 – Lateral movement of un-leaded devices check points D to F Figure C.4 – Lead protection gap |
