BS EN IEC 60384-2:2021 – TC:2022 Edition
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Tracked Changes. Fixed capacitors for use in electronic equipment – Sectional specification. Fixed metallized polyethyleneterephthalate film dielectric DC capacitors
Published By | Publication Date | Number of Pages |
BSI | 2022 | 94 |
This part of IEC 60384 applies to fixed capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have a possibility of “self-healing properties” depending on conditions of use. They are primarily intended for applications where the AC component is small with respect to the rated voltage. Two performance grades of capacitors are covered: grade 1 for long-life application and grade 2 for general application. Capacitors for electromagnetic interference suppression and surface mount fixed metallized polyethylene-terephthalate film dielectric DC capacitors are not included, but are covered by IEC 60384-14 and IEC 60384-19, respectively. The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring methods, and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification are of equal or higher performance level, because lower performance levels are not permitted.
PDF Catalog
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1 | 30454896 |
57 | A-30372506 |
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61 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
63 | CONTENTS |
66 | FOREWORD |
68 | 1 Scope 2 Normative references 3 Terms and definitions |
69 | 4 Preferred ratings and characteristics 4.1 Preferred characteristics 4.2 Preferred values of ratings 4.2.1 Nominal capacitance (CN) 4.2.2 Tolerance on nominal capacitance |
70 | 4.2.3 Rated voltage (UR) 4.2.4 Category voltage (UC) 4.2.5 Rated temperature 5 Test and measurement procedures, and performance requirements 5.1 Visual examination and check of dimensions 5.2 Electrical tests 5.2.1 Voltage proof |
71 | 5.2.2 Capacitance 5.2.3 Tangent of loss angle (tan δ) Tables Table 1 – Test points and voltages |
72 | 5.2.4 Insulation resistance Table 2 – Tangent of loss angle requirements |
73 | 5.3 Robustness of terminations 5.3.1 General 5.3.2 Initial inspections Table 3 – Insulation resistance requirements Table 4 – Correction factors |
74 | 5.3.3 Test method 5.3.4 Final inspections and requirements 5.4 Resistance to soldering heat 5.4.1 General 5.4.2 Test conditions 5.4.3 Final inspections and requirements 5.5 Solderability 5.5.1 General 5.5.2 Test conditions |
75 | 5.5.3 Final requirements 5.6 Rapid change of the temperature 5.6.1 General 5.6.2 Initial inspections 5.6.3 Test conditions 5.6.4 Final inspections 5.7 Vibration 5.7.1 General 5.7.2 Test conditions 5.7.3 Final inspections and requirements 5.8 Bump (repetitive shock) 5.8.1 General 5.8.2 Initial inspections |
76 | 5.8.3 Test conditions 5.8.4 Final inspections and requirements 5.9 Shock 5.9.1 General 5.9.2 Initial inspections 5.9.3 Test conditions 5.9.4 Final inspections and requirements Table 5 – Preferred severities |
77 | 5.10 Climatic sequence 5.10.1 General 5.10.2 Initial inspections 5.10.3 Dry heat 5.10.4 Damp heat, cyclic, Test Db, first cycle 5.10.5 Cold 5.10.6 Low air pressure 5.10.7 Damp heat, cyclic, Test Db, remaining cycles |
78 | 5.11 Damp heat, steady state 5.11.1 General 5.11.2 Initial inspections 5.11.3 Test conditions 5.11.4 Final inspections and requirements 5.12 Endurance 5.12.1 General 5.12.2 Initial inspections 5.12.3 Test conditions 5.12.4 Final inspections and requirements Table 6 – Test conditions |
79 | 5.13 Charge and discharge 5.13.1 General 5.13.2 Initial inspections 5.13.3 Test conditions Table 7 – Lead spacing and dU/dt |
80 | 5.13.4 Final inspections and requirements 5.14 Component solvent resistance 5.15 Solvent resistance of the marking 6 Marking 6.1 General 6.2 Information for marking 6.3 Marking of capacitors 6.4 Marking of packaging 6.5 Additional marking |
81 | 7 Information to be given in a detail specification 7.1 General 7.2 Outline drawing and dimensions 7.3 Mounting 7.4 Rating and characteristics 7.4.1 General 7.4.2 Particular characteristics 7.4.3 Soldering |
82 | 7.5 Marking 8 Quality assessment procedures 8.1 Primary stage of manufacture 8.2 Structurally similar components 8.3 Certified records of released lots 8.4 Qualification approval procedures 8.4.1 General 8.4.2 Qualification approval on the basis of the fixed sample size procedures |
84 | Table 8 – Sampling plan together with numbers of permissible non-conformance for qualification approval test |
85 | Table 9 – Test schedule for qualification approval (1 of 5) |
89 | 8.5 Quality conformance inspection 8.5.1 Formation of inspection lots |
90 | 8.5.2 Test schedule 8.5.3 Delayed delivery 8.5.4 Assessment levels Table 10 – Lot-by-lot inspection |
91 | Table 11 – Periodic inspection |
92 | Annex X (informative) Cross-references to the previous edition of this document Table X.1 – Cross-references |
93 | Bibliography |