BS EN IEC 61189-2-807:2021

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for materials for interconnection structures. Decomposition temperature (T_d) using TGA

Published By	Publication Date	Number of Pages
BSI	2021	14

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Description

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PDF Pages	PDF Title
2	undefined
5	Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
7	English CONTENTS
8	FOREWORD
10	1 Scope 2 Normative references 3 Terms and definitions 4 Test specimens
11	5 Test apparatus 6 Test procedure
12	7 Report Figure 1 – Mass-temperature curve
13	Bibliography

Additional information

Status	Definitive
Pages	14
Publication Date	2021-11-05
ISBN	978 0 539 12605 1
Standard Number	BS EN IEC 61189-2-807:2021
Title	Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA
Identical National Standard Of	EN 61189-2-807 Ed.1.0, IEC 61189-2-807 Ed.1.0
Descriptors	Structures, Open systems interconnection, Printing board, Testing methods
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BS EN IEC 61189-2-807:2021

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