BS EN IEC 61280-4-1:2019+A1:2022:2023 Edition
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Fibre-optic communication subsystem test procedures – Installed cabling plant. Multimode attenuation measurement
Published By | Publication Date | Number of Pages |
BSI | 2023 | 84 |
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
7 | English CONTENTS |
12 | FOREWORD |
14 | 1 Scope 2 Normative references 3 Terms, definitions, graphical symbols and abbreviated terms |
15 | 3.1 Terms and definitions |
17 | 3.2 Graphical symbols |
18 | Figures Figure 1 – Connector symbols Figure 2 – Symbol for cabling under test |
19 | 3.3 Abbreviated terms 4 Test methods 4.1 General |
20 | 4.2 Cabling configurations and applicable test methods Tables Table 1 – Cabling configurations Table 2 – Test methods and configurations |
21 | Figure 3 – Reference plane for configuration A tested with the 1-cord method Figure 4 – Reference plane for configuration B tested with the 3-cord method |
22 | 5 Overview of uncertainties 5.1 General 5.2 Sources of significant uncertainties Figure 5 – Reference plane for configuration C tested with the 2-cord method Figure 6 – Reference plane for configuration D tested with the EC method |
23 | 5.3 Consideration of the PM 5.4 Consideration of test cord connector grade 5.5 Typical uncertainty values Table 3 – Measurements bias related to test cord connector grade |
24 | 6 Apparatus 6.1 General 6.2 Light source 6.2.1 Stability 6.2.2 Spectral characteristics (LSPM measurement) Table 4 – Uncertainty for a given attenuation at 850 nm Table 5 – Spectral requirements |
25 | 6.3 Launch cord 6.4 Receive or tail cord |
26 | 6.5 Substitution cord 6.6 Power meter – LSPM methods only 6.7 OTDR apparatus Figure 7 – OTDR schematic |
27 | 6.8 Connector end face cleaning and inspection equipment 6.9 Adapters 7 Procedures 7.1 General 7.2 Common procedures 7.2.1 Care of the test cords 7.2.2 Make reference measurements (LSPM methods only) 7.2.3 Inspect and clean the ends of the optical fibres in the cabling |
28 | 7.2.4 Make the measurements 7.2.5 Make the calculations 7.2.6 Duplex and bi-directional testing 7.3 Calibration 7.4 Safety 8 Calculations 9 Documentation 9.1 Information for each test |
29 | 9.2 Information to be available |
30 | Annexes Annex A (normative) One-cord method A.1 Applicability of test method A.2 Apparatus A.3 Procedure |
31 | A.4 Calculation A.5 Components of reported attenuation Figure A.1 – Reference measurement Figure A.2 – Test measurement |
32 | Annex B (normative) Three-cord method B.1 Applicability of test method B.2 Apparatus B.3 Procedure Figure B.1 – Reference measurement |
33 | B.4 Calculations B.5 Components of reported attenuation Figure B.2 – Test measurement |
34 | Annex C (normative) Two-cord method C.1 Applicability of test method C.2 Apparatus C.3 Procedure Figure C.1 – Reference measurement |
35 | C.4 Calculations C.5 Components of reported attenuation Figure C.2 – Test measurement Figure C.3 – Test measurement for plug-socket style connectors |
37 | Annex D (normative) Equipment cord method D.1 Applicability of the test method D.2 Apparatus D.3 Procedure |
38 | D.4 Calculation D.5 Components of reported attenuation Figure D.1 – Reference measurement Figure D.2 – Test measurement |
39 | D.6 Typical uncertainty values Table D.1 – Uncertainty for a given attenuation at 850 nm |
40 | Annex E (normative) Optical time domain reflectometer E.1 Applicability of the test method E.2 Apparatus E.2.1 General E.2.2 OTDR E.2.3 Test cords |
41 | E.3 Procedure (test method) Figure E.1 – OTDR method |
42 | E.4 Calculation E.4.1 General E.4.2 Connection location Figure E.2 – Location of the ports of the cabling under test |
43 | E.4.3 Definition of power levels F1 and F2 E.4.4 Alternative calculation Figure E.3 – Graphic construction of F1 and F2 |
45 | E.5 OTDR uncertainties Figure E.4 – Graphic construction of F1, F11, F12 and F2 |
47 | Annex F (normative) Requirements for the source characteristics F.1 Encircled flux F.2 Assumptions and limitations F.3 Encircled flux templates F.3.1 General |
48 | F.3.2 Uncertainties expectations F.3.3 Templates Table F.1 – Attenuation, threshold tolerance and confidence level Table F.2 – EF requirements for 50 µm core optical fibre cabling at 850 nm |
49 | F.4 Graphical representation of templates Table F.3 – EF requirements for 50 μm core optical fibre cabling at 1 300 nm Table F.4 – EF requirements for 62,5 μm core optical fibre cabling at 850 nm Table F.5 – EF requirements for 62,5 μm core optical fibre cabling at 1 300 nm |
50 | Figure F.1 – Encircled flux example |
51 | Annex G (informative) OTDR configuration information G.1 General |
52 | G.2 Fundamental parameters that define the operational capability of an OTDR G.2.1 Dynamic range G.2.2 Pulse width G.2.3 Averaging time G.2.4 Dead zone G.3 Other parameters G.3.1 Index of refraction |
53 | G.3.2 Measurement range G.3.3 Distance sampling G.4 Other measurement configurations G.4.1 General G.4.2 Macrobend or splice attenuation measurement Table G.1 – Default effective group index of refraction values |
54 | G.4.3 Splice attenuation measurement G.4.4 Measurement with high reflection connectors or short length cabling Figure G.1 – Splice and macrobend attenuation measurement |
55 | Figure G.2 – Attenuation measurement with high reflection connectors |
56 | G.4.5 Ghost Figure G.3 – Attenuation measurement of a short length cabling |
57 | G.5 More on the measurement method Figure G.4 – OTDR trace with ghost |
58 | G.6 Bi-directional measurement Figure G.5 – Cursor positioning |
59 | G.7 Non-recommended practices G.7.1 Measurement without tail test cord G.7.2 Cursor measurement |
60 | Annex H (informative) Test cord attenuation verification H.1 General H.2 Apparatus H.3 Procedure H.3.1 General |
61 | H.3.2 Test cord verification for the one-cord and two-cord methods when using non-pinned/unpinned and non-plug/socket style connectors |
62 | H.3.3 Test cord verification for the one-cord and two-cord methods when using pinned/unpinned or plug/socket style connectors Figure H.1 – Obtaining reference power level P0 Figure H.2 – Obtaining power level P1 |
63 | Figure H.3 – Obtaining reference power level P0 Figure H.4 – Obtaining power level P1 |
64 | H.3.4 Test cord verification for the three-cord method when using non-pinned/unpinned and non-plug/socket style connectors Figure H.5 – Obtaining reference power level P0 Figure H.6 – Obtaining power level |
65 | Figure H.7 – Obtaining reference power level P0 Figure H.8 – Obtaining power level P1 |
66 | H.3.5 Test cord verification for the three-cord method when using pinned/unpinned or plug/socket style connectors Figure H.9 – Obtaining power level P5 |
67 | Figure H.10 – Obtaining reference power level P0 Figure H.11 – Obtaining power level P1 |
68 | Annex I (normative) On the use of reference-grade test cords I.1 General I.2 Practical configurations and assumptions I.2.1 Component specifications |
69 | I.2.2 Conventions I.2.3 Reference planes I.3 Impact of using reference grade test cords for recommended LSPM methods |
70 | I.4 Examples for LSPM measurements I.4.1 Example 1 (configuration A, 1-C method – Annex A) I.4.2 Example 2 (configuration D, EC method – Annex D) Table I.1 – Measurement bias when using reference-grade test cords |
71 | I.5 Impact of using reference-grade test cords for different configurations using the OTDR test method I.5.1 Cabling configurations A, B and C Figure I.1 – Cabling configurations A, B and C tested with the OTDR method |
72 | I.5.2 Cabling configuration D Table I.2 – Measurement bias when using reference grade test cords – OTDR test method |
73 | Figure I.2 – Cabling configuration D tested with the OTDR method |
74 | Annex J (informative) Launch cord output near-field verification J.1 Direct verification J.2 Test equipment manufacturer verification J.3 Field check with physical artefact J.3.1 General |
75 | Figure J.1 – Initial power measurement Figure J.2 – Verification of reference-grade connection Figure J.3 – Two offset splices |
76 | J.3.2 Procedure for attenuation characterization of artefacts J.3.3 Construction details Figure J.4 – Five offset splices |
77 | J.3.4 Example results Figure J.5 – EF centred |
78 | Figure J.6 – EF underfilling Figure J.7 – EF overfilling |
79 | Figure J.8 – L1 attenuation with mandrel Figure J.9 – L1 attenuation with mandrel and mode conditioner Figure J.10 – L2 attenuation with mandrel |
80 | Figure J.11 – L2 attenuation with mandrel and mode conditioning Figure J.12 – L3 attenuation with mandrel Figure J.13 – L3 attenuation with mandrel and mode conditioning |
81 | Bibliography |