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BS EN IEC 61760-3:2021

BS EN IEC 61760-3:2021

$167.15

Surface mounting technology – Standard method for the specification of components for through-hole reflow (THR) soldering

Published By Publication Date Number of Pages
BSI 2021 34
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This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
9 FOREWORD
11 1 Scope
2 Normative references
12 3 Terms and definitions
14 4 Requirements to component design and component specifications
4.1 General requirement
4.2 Packaging
Figures
Figure 1 – Example of a component with marked specific orientation put in tape and tray
15 4.3 Labelling of component packaging
4.4 Component marking
4.5 Storage and transportation
4.6 Component outline and design
4.6.1 Drawing and specification
Figure 2 – Example of components in a tape
16 4.6.2 Requirement of pick-up area
17 Figure 3 – Pick-up area
Figure 4 – Chuck jaw
18 4.6.3 Component tilt
4.6.4 Bottom surface requirements
Figure 5 – Component side flat surface
Figure 6 – Component top flat surface
19 4.6.5 Terminal requirements
Figure 7 – Clearance
Figure 8 – Stand-off height
20 Figure 9 – Terminal length and protrusion length
21 Figure 10 – Terminal position tolerance 0,2 mm
22 Figure 11 – Terminal position tolerance 0,4 mm
23 Figure 12 – Terminal shape
24 4.6.6 Optical recognition
4.6.7 Component height
Figure 13 – Solder wetting
25 4.6.8 Component mass
4.7 Mechanical stress
4.8 Component reliability
4.9 Additional requirements for compatibility with lead-free soldering
5 Typical process conditions for THR soldering process
5.1 Mounting by through-hole reflow soldering
26 5.2 Solder paste supply
Figure 14 – Typical soldering process steps
27 5.3 Component insertion
5.4 Reflow soldering methods (recommended)
Figure 15 – Solder paste supply
28 5.5 Cleaning
5.5.1 General
5.5.2 Cleaning medium and cleaning method
5.5.3 Cleaning process conditions
29 5.6 Removal and/or replacement of soldered components
6 Relevant tests and requirements for components and component specifications for THR soldering process
6.1 General
Tables
Table 1 – Typical cleaning conditions
30 6.2 Wettability
6.3 Dewetting
6.4 Resistance to soldering heat
6.5 Resistance to cleaning solvent
6.5.1 General
31 6.5.2 Solvent resistance of component
6.5.3 Solvent resistance of marking
6.6 Soldering profile
6.7 Moisture sensitivity level
7 Quality criteria for THR soldering
32 Figure A.1 – Example of the flux creeping-up
Figure A.2 – Example of the solder wicking
33 Bibliography

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BS EN IEC 61760-3:2021
$167.15