BS EN IEC 62239-1:2018
$215.11
Process management for avionics. Management plan – Preparation and maintenance of an electronic components management plan
| Published By | Publication Date | Number of Pages |
| BSI | 2018 | 80 |
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished.
In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (OEM).
SAE EIA-STD-4899 can be used to comply with the requirements of IEC 62239‑1 where applicable (see Annex C), to enable the plan owner to harmonise its plan for both documents.
This document provides an aid in the aerospace certification process.
Although developed for the avionics industry, this process can be applied by other industrial sectors.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
| 6 | English CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 11 | 1 Scope 2 Normative references |
| 12 | 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions |
| 16 | 3.2 Abbreviated terms |
| 18 | 4 Technical requirements 4.1 General 4.2 Component selection 4.2.1 General |
| 19 | 4.2.2 Application conditions for use 4.2.3 Availability and durability 4.2.4 Additional performance 4.2.5 Component identification |
| 20 | 4.3 Component application 4.3.1 General 4.3.2 Electromagnetic compatibility (EMC) 4.3.3 Derating and stress analysis |
| 22 | 4.3.4 Thermal analysis 4.3.5 Mechanical analysis |
| 23 | 4.3.6 Testing, testability, and maintainability 4.3.7 Avionics radiation environment 4.3.8 Management of lead-free termination finish and soldering |
| 24 | 4.3.9 Counterfeited, fraudulent and recycled component avoidance 4.3.10 Moisture and corrosion 4.3.11 Additional customer related application requirements 4.4 Component qualification 4.4.1 General Figure 1 – Suspect components perimeter |
| 25 | 4.4.2 Minimum component qualification requirements 4.4.3 Original component manufacturer quality management 4.4.4 Original component manufacturer process management approval |
| 26 | 4.4.5 Demonstration of component qualification |
| 27 | 4.4.6 Qualification of components from a supplier that is not qualified |
| 28 | 4.4.7 Distributor process management approval 4.4.8 Subcontractor assembly facility quality and process management approval |
| 29 | 4.5 Continuous component quality assurance 4.5.1 General quality assurance requirements 4.5.2 Ongoing component quality assurance 4.5.3 Plan owner in-house continuous monitoring |
| 30 | 4.5.4 Component design and manufacturing process change monitoring 4.6 Component dependability 4.6.1 General 4.6.2 Component availability and associated risk assessment |
| 31 | 4.6.3 Component obsolescence 4.6.4 Proactive measures 4.6.5 Component obsolescence awareness 4.6.6 Reporting |
| 32 | 4.6.7 Semiconductor reliability, wear out and lifetime 4.6.8 Reliability assessment 4.7 Component compatibility with the equipment manufacturing process |
| 33 | 4.8 Component data 4.8.1 General |
| 34 | 4.8.2 Minimum component data requirements 4.9 Configuration control 4.9.1 General 4.9.2 Alternative components 4.9.3 Alternative sources |
| 35 | 4.9.4 Equipment change documentation 4.9.5 Customer notifications and approvals 4.9.6 Focal organization 5 Plan administration requirements 5.1 Plan organization 5.2 Plan terms and definitions 5.3 Plan focal point 5.3.1 Primary interface |
| 36 | 5.3.2 Plan focal point responsibilities 5.4 Plan references 5.5 Plan applicability 5.6 Plan implementation 5.6.1 ECMP compliance 5.6.2 Plan objectives |
| 37 | 5.6.3 Plan owner’s subcontracted activities 5.7 Plan acceptance 5.8 Plan maintenance |
| 38 | Annex A (informative)Requirement matrix for IEC 62239-1 Tables Table A.1 – Requirements matrix |
| 54 | Annex B (informative)Typical qualification requirements and typical componentminimum qualification requirements Table B.1 – Typical qualification requirements and typical component minimum qualification requirements |
| 57 | Annex C (informative)IEC 62239-1 cross-references to SAE EIA-STD-4899 for guidance Table C.1 – Cross-reference overview between IEC 62239-1and SAE EIA-STD-4899, for guidance |
| 60 | Annex D (informative)Guidelines for environmental protection techniques and for comparison of components specifications Table D.1 – Environmental protection techniques to be considered during the avionics design process |
| 65 | Table D.2 – Guidelines for the comparison of internationally available component specifications – Microcircuitsa |
| 74 | Bibliography |
