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BS EN IEC 62435-9:2021

BS EN IEC 62435-9:2021

$102.76

Electronic components. Long-term storage of electronic semiconductor devices – Special cases

Published By Publication Date Number of Pages
BSI 2021 22
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This part of IEC 62435 specifies storage practices encompassing silicon and semiconductor device building blocks of all types that are integrated together to into products in the form of either packages or boards that can be stored as fully assembled units or partial assemblies. Special attention is given to memories as components and assemblies although methods also apply to heterogeneous components. Guidelines and requirements for customer-supplier interaction are provided to manage the complexity.

NOTE In IEC 62435 (all parts), the term “components” is used interchangeably with dice, wafers, passives and packaged devices.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
8 FOREWORD
10 INTRODUCTION
12 1 Scope
2 Normative references
3 Terms and definitions
14 4 Component storage cases
5 Storage of memory devices
5.1 General
5.2 Semiconductor memory device types
15 Table 1 – Example failure mechanisms and stimuli for memory devices
16 6 Storage of other devices and partial assembly
6.1 General
6.2 Wafer-level chip-scale packages
17 6.3 Heterogeneous devices
6.4 Modules
7 Storage in alternative environments
7.1 General
7.2 Alternative environments
18 7.3 Storage environment effect on use reliability
19 Annex A (informative)Customer-supplier interaction
Table A.1 – Supplier – customer interaction template
20 Bibliography

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BS EN IEC 62435-9:2021
$102.76