BS EN IEC 62878-2-602:2021

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Device embedding assembly technology – Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

Published By	Publication Date	Number of Pages
BSI	2021	18

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IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

PDF Catalog

PDF Pages	PDF Title
2	undefined
5	Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
7	English CONTENTS
8	FOREWORD
10	INTRODUCTION
11	1 Scope 2 Normative references 3 Terms and definitions 4 General Figures Figure 1 – Stackable electronic module
12	5 Test apparatus Figure 2 – Stacked electronic module
13	6 Test specimen 6.1 General Figure 3 – Test apparatus
14	6.2 Preparation of test specimen 7 Evaluation test 7.1 Test method 7.2 Measurement 7.3 Test procedure Figure 4 – Illustration of a typical test specimen
15	Figure 5 – Input and output interface between test specimen and test apparatus
16	Annex A (informative)Specification of test specimen on outline size and terminal layout Figure A.1 – Outline drawing of test specimen Table A.1 – The final specifications
17	Annex B (informative)Representative examples of stacking assembly methods Table B.1 – Representative examples of stacking assembly methods