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BS EN ISO 9455-17:2024 – TC

$186.33

Tracked Changes. Soft soldering fluxes. Test methods – Surface insulation resistance comb test and electrochemical migration test of flux residues

Published By Publication Date Number of Pages
BSI 2024 69
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This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

PDF Catalog

PDF Pages PDF Title
1 30486924
40 A-30450738
41 undefined
53 7.1 Surface plating
7.1.1 Slivering (thin metal overhang on etch runs)
54 7.1.2 Plating nodules
7.1.3 Plating pits
7.2 Surface laminate
8.1 Preparation of the flux test solution
8.1.1 Liquid flux samples
8.1.2 Solid flux samples
8.1.3 Flux-cored solder wire or preform samples
55 8.1.4 Solder paste samples
8.1.5 Paste flux samples
8.2 Preparation of the test coupons
8.2.1 Sample identification
8.2.2 Test coupons
56 8.2.3 Test coupon pre-cleaning
9.1 Methods for connecting test coupons
9.1.1 Board circuitry layout
58 9.1.2 Preconditioning of SIR test coupons prior to processing (optional)
9.2 Fluxing and soldering test patterns
9.2.1 Liquid and solid flux samples and flux-cored solder wire samples
9.2.2 Soldering using wave solder system
9.2.3 Soldering using static solder pot
59 9.2.4 Solder paste samples
9.2.5 Paste flux samples
9.3 Cleaning
60 9.4 SIR measurement
9.4.1 High-resistance measurement system verification
9.4.2 Test coupon measurements
9.5 Electrochemical migration test
BS EN ISO 9455-17:2024 - TC
$186.33