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BS IEC 62047-34:2019

BS IEC 62047-34:2019

$102.76

Semiconductor devices. Micro-electromechanical devices – Test methods for MEMS piezoresistive pressure-sensitive device on wafer

Published By Publication Date Number of Pages
BSI 2019 20
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IEC 62047-34:2019 (E) describes test conditions and test methods of electric character, static performances and thermal performances for MEMS pressure-sensitive devices. This document applies to test for both open and closed loop piezoresistive MEMS pressure devices on wafer.

PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
5 FOREWORD
7 1 Scope
2 Normative references
3 Terms and definitions
8 4 Test conditions
4.1 Atmospheric conditions
4.2 Electromagnetic conditions
4.3 Vibration conditions
4.4 Test system
9 5 General provisions
5.1 Certificate documents
5.2 Placement and preheating time
5.3 Connection
6 Test items and methods
6.1 Test preparation
6.2 Resistance
6.2.1 Purpose
6.2.2 Test methods
10 6.3 Static performances
6.3.1 Purpose
6.3.2 Test items
Figure 1 – Closed loop bridge
Figure 2 – Open loop bridge
11 6.3.3 Test method
Figure 3 – Five-point sampling
15 6.4 Thermal performances
6.4.1 Purpose
16 6.4.2 Test items
6.4.3 Test method
18 Bibliography

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BS IEC 62047-34:2019
$102.76