BS IEC 62899-202-6:2020
$102.76
Printed electronics – Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate
Published By | Publication Date | Number of Pages |
BSI | 2020 | 18 |
This part of IEC 62899 provides a method of in-situ measurement for the resistance change of a conductive layer formed by printing methods on a flexible substrate under specified temperature and humidity conditions.
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
4 | CONTENTS |
5 | FOREWORD |
7 | INTRODUCTION |
8 | 1 Scope 2 Normative references 3 Terms and definitions |
9 | 4 Test sample and measurement equipment 4.1 General 4.2 Sample shape and size for measuring resistance change 5 Test conditions 5.1 General 5.2 Test conditions under temperature and humidity 5.3 Test conditions at high temperature 5.4 Test conditions for thermal cycling |
10 | 6 Test method and test apparatus 6.1 General Figures Figure 1 – Schematic diagram of environmental test jig of printedconductive film for two-wire measurement Figure 2 – Schematic diagram of environmental test jig of printedconductive film for four-wire measurement |
11 | 6.2 Test apparatus 6.3 Test procedure Figure 3 – Schematic diagram of environmental test jig of printedconductive film with screws for a four-wire measurement Figure 4 – Image of metal grip for connection |
12 | 6.4 Measurement 7 Data analysis 7.1 Reporting the electrical property Tables Table 1 – Options for duration time and interval of collecting data Table 2 – Resistance range of the test piece and applied current(see IEC 62899-202) |
13 | 7.2 Reporting of results |
14 | Annex A (informative)An example of environmental test Figure A.1 – Image of environment reliability test sample |
15 | Table A.1 – Test result |
16 | Figure A.2 – Resistance change at a temperature of 85 °C and a humidity of 85 % |
17 | Bibliography |