BSI 19/30395803 DC:2019 Edition
$13.70
BS EN 60749-15. Semiconductor devices. Mechanical and climatic test methods – Part 15. Resistance to soldering temperature for through-hole mounted devices
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 10 |
| Status | Definitive |
|---|---|
| Pages | 10 |
| Publication Date | 2019-07-10 |
| Standard Number | 19/30395803 DC |
| Title | BS EN 60749-15. Semiconductor devices. Mechanical and climatic test methods – Part 15. Resistance to soldering temperature for through-hole mounted devices |
| Identical National Standard Of | 47/2575/CDV |
| Descriptors | Soldering, Environmental testing, Solderability testing, Slots, Destructive testing, Semiconductor devices, Encapsulated, Holes, Integrated circuits, Climate, Thermal testing, Electronic equipment and components, Mechanical testing |
| Publisher | BSI |
| Committee | EPL/47 |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
