BSI 21/30441791 DC:2021 Edition
$13.70
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
Published By | Publication Date | Number of Pages |
BSI | 2021 | 10 |
Status | Definitive |
---|---|
Pages | 10 |
Publication Date | 2021-07-30 |
Standard Number | 21/30441791 DC |
Title | BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA |
Identical National Standard Of | IEC 61189-2-809 ED1 |
Descriptors | Materials by form, Printed-wiring boards, Printing board, Boards, Board (paper) |
Publisher | BSI |
Committee | EPL/501 |
ICS Codes | 29.035.10 - Paper and board insulating materials |