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BSI 23/30472390 DC 2023

BSI 23/30472390 DC 2023

$13.70

BS EN 60747-16-11 Semiconductor devices – Part 16-11. Microwave integrated circuits – Power detectors

Published By Publication Date Number of Pages
BSI 2023 34
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PDF Catalog

PDF Pages PDF Title
8 FOREWORD
10 1 Scope
2 Normative references
3 Terms and definitions
12 4 Essential ratings and characteristics
4.1 General requirements
4.1.1 Circuit identification and types
4.1.2 General function description
4.1.3 Manufacturing technology
4.1.4 Package identification
4.2 Application description
4.2.1 Conformance to system and/or interface information
4.2.2 Overall block diagram
13 4.2.3 Reference data
4.2.4 Electrical compatibility
4.2.5 Associated devices
4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks
4.3.2 Identification and function of terminals
14 4.3.3 Function description
4.4 Limiting values (absolute maximum rating system)
4.4.1 Requirements
15 4.4.2 Electrical limiting values
4.4.3 Temperatures
4.5 Operating conditions (within the specified operating temperature range)
16 4.6 Electrical characteristics
4.7 Mechanical and environmental ratings, characteristics and data
4.8 Additional information
17 5 Measuring methods
5.1 General
5.1.1 General precautions
5.1.2 Characteristic impedance
5.1.3 Handling precautions
5.1.4 Types
5.2 Tangential signal sensitivity (PTSS)
5.2.1 Purpose
5.2.2 Circuit diagram
18 5.2.3 Principle of measurement
19 5.2.4 Circuit description and requirements
5.2.5 Precautions to be observed
5.2.6 Measurement procedure
5.2.7 Specified conditions
5.3 Input return loss (RL)
5.3.1 Purpose
20 5.3.2 Measuring methods
5.3.2.1 General
5.3.2.2 Measuring method 1
5.3.2.2.1 Circuit diagram
5.3.2.2.2 Principle of measurement
5.3.2.2.3 Circuit description and requirements
21 5.3.2.2.4 Precautions to be observed
5.3.2.2.5 Measurement procedure
5.3.2.2.6 Specified conditions
5.3.2.3 Measuring method 2
5.3.2.3.1 Circuit diagram
22 5.3.2.3.2 Principle of measurement
5.3.2.3.3 Circuit description and requirements
5.3.2.3.4 Precautions to be observed
5.3.2.3.5 Measurement procedure
5.3.2.3.6 Specified conditions
5.4 Output voltage (Vo)
5.4.1 Purpose
5.4.2 Circuit diagram
23 5.4.3 Principle of measurement
5.4.4 Circuit description and requirements
5.4.5 Precautions to be observed
5.4.6 Measurement procedure
5.4.7 Specified conditions
5.5 Voltage sensitivity (βv)
5.5.1 Purpose
24 5.5.2 Circuit diagram
5.5.3 Principle of measurement
5.5.4 Circuit description and requirements
5.5.5 Precautions to be observed
5.5.6 Measurement procedure
5.5.7 Specified conditions
5.6 Current sensitivity (βi)
5.6.1 Purpose
5.6.2 Circuit diagram
25 5.6.3 Principle of measurement
5.6.4 Circuit description and requirements
5.6.5 Precautions to be observed
5.6.6 Measurement procedure
26 5.6.7 Specified conditions
5.7 Frequency response flatness (△P)
5.7.1 Purpose
5.7.2 Circuit diagram
5.7.3 Principle of measurement
5.7.4 Circuit description and requirements
5.7.5 Precautions to be observed
5.7.6 Measurement procedure
5.7.7 Specified conditions
27 5.8 Output slope (k)
5.8.1 Purpose
5.8.2 Circuit diagram
5.8.3 Principle of measurement
5.8.4 Circuit description and requirements
5.8.5 Precautions to be observed
5.8.6 Measurement procedure
5.8.7 Specified conditions
28 5.9 Output intercept point (Pip)
5.9.1 Purpose
5.9.2 Circuit diagram
5.9.3 Principle of measurement
5.9.4 Circuit description and requirements
5.9.5 Precautions to be observed
5.9.6 Measurement procedure
5.9.7 Specified conditions
5.10 Dynamic range
5.10.1 Purpose
29 5.10.2 Circuit diagram
5.10.3 Principle of measurement
5.10.4 Circuit description and requirements
5.10.5 Precautions to be observed
5.10.6 Measurement procedure
30 5.10.7 Specified conditions
5.11 Temperature sensitivity (βT)
5.11.1 Purpose
5.11.2 Circuit diagram
5.11.3 Principle of measurement
5.11.4 Circuit description and requirements
5.11.5 Precautions to be observed
31 5.11.6 Measurement procedure
5.11.7 Specified conditions
5.12 Rise time(tr(out)), fall time(tf(out)), rising edge propagation delay(trd) and falling edge propagation delay(tfd)
5.12.1 Purpose
5.12.2 Circuit diagram
32 5.12.3 Principle of measurement
33 5.12.4 Circuit description and requirements
5.12.5 Precautions to be observed
5.12.6 Measurement procedure
5.12.7 Specified conditions
34 Bibliography

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