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BSI PD ES 59008-4-3:2000

BSI PD ES 59008-4-3:2000

$86.31

Data requirements for semiconductor die. Specific requirements and recommendations – Thermal

Published By Publication Date Number of Pages
BSI 2000 12
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Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures and minimally-packaged semiconductor die. Specifies requirements of operational thermal conditions of unpackaged and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in it’s use.

BSI PD ES 59008-4-3:2000
$86.31