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BSI PD IEC TR 61189-5-506:2019

BSI PD IEC TR 61189-5-506:2019

$142.49

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Published By Publication Date Number of Pages
BSI 2019 26
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This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
6 FOREWORD
8 INTRODUCTION
9 1 Scope
2 Normative references
3 Terms and definitions
4 Test board concept for intercomparison
4.1 The need for a fine-pitch SIR pattern
10 4.2 Test board design
11 4.3 Test board fluxing
Figures
Figure 1 – TB144
Tables
Table 1 – SIR pattern information
12 5 Test procedure for intercomparison
5.1 Sample preparation
Table 2 – Flux to be used for SIR evaluation test
Table 3 – Samples for SIR evaluation testing
13 5.2 Preparation of samples for humidity chamber
5.3 Placement of samples inside the humidity chamber
Figure 2 – Connector arrangement
14 5.4 Resistance measurements
5.5 Evaluation of results
5.6 Additional information
6 Results
Figure 3 – Sample orientation in test chamber
15 Figure 4 – Participants’ (a to f) resistance measurements for the six test patterns on the checkerboard
Figure 5 – Participant A control boards
16 Figure 6 – Participant A flux loaded boards
Figure 7 – Participant B control boards
Figure 8 – Participant B flux loaded boards
17 Figure 9 – Participant C control boards
Figure 10 – Participant C flux loaded boards
Figure 11 – Participant D control boards
18 Figure 12 – Participant D flux loaded boards
Figure 13 – Participant E control boards
Figure 14 – Participant E flux loaded boards
19 Figure 15 – Participant F control boards
Figure 16 – Participant F flux loaded boards
Figure 17 – Participant G control boards
20 Figure 18 – Participant G flux loaded boards
Figure 19 – Participant D, and evidence of a fibre and the effect on the SIR
Figure 20 – Participant E and evidence of corrosion shorting across the gap
21 Figure 21 – Participant G and evidence of a water droplet and the resulting drop in SIR and dendrite like failure
Figure 22 – Participant G and a corrosion defect probably from a flux residue
Figure 23 – Participant C dendrites and corrosions formed on all SIR patternsof all fluxed samples tested at 85°C/85%
22 Figure 24 – The average final SIR value for the control boards
Figure 25 – The average final SIR value for the flux loaded boards
23 Figure 26 – The average final SIR for flux-loaded patterns by participant
Figure 27 – Final SIR plotted as ohm.squares
24 Figure 28 – Ratio of the log Ω.square value to the 500-µm pattern
25 Bibliography

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BSI PD IEC TR 61189-5-506:2019
$142.49