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BSI PD IEC/TR 62878-2-2:2015

BSI PD IEC/TR 62878-2-2:2015

$102.76

Device embedded substrate – Guidelines. Electrical testing

Published By Publication Date Number of Pages
BSI 2015 20
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This part of IEC 62878, which is a Technical Report, describes the necessary information on electrical testing for device embedded substrate. This includes the interconnection open- and short-circuit tests as well as the device functional test. It also provides guidelines by demonstrating the electrical test for device embedded substrate.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

The IEC 62878 series does not apply to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

PDF Catalog

PDF Pages PDF Title
4 English
CONTENTS
5 FOREWORD
7 INTRODUCTION
Figures
Figure 1 – Interconnection open/short test
8 1 Scope
2 Electrical tests
2.1 Test level 1A for device embedded substrate
9 2.2 Test level 1B for component embedded substrate
2.3 Test level 2A for component embedded substrate
Figure 2 – Test level 1A
Figure 3 – Test level 1B
10 Figure 4 – Test level 2A
11 2.4 Test level 2B for passive device embedded substrate
Figure 5 – Test level 2B
12 2.5 Test level 3 for device embedded substrate
Figure 6 – Device embedded substrate with two or more passive devices
13 Figure 7 – Test level 3 for functional test
14 3 Electrical test procedure for device embedded substrate
Figure 8 – Circuit model and simulation result
15 Figure 9 – Preparation for the test setup
16 Figure 10 – Test procedure flow
17 Bibliography

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BSI PD IEC/TR 62878-2-2:2015
$102.76