BSI PD IEC/TS 62132-9:2014
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Integrated circuits. Measurement of electromagnetic immunity – Measurement of radiated immunity. Surface scan method
Published By | Publication Date | Number of Pages |
BSI | 2014 | 32 |
This part of IEC 62132 provides a test procedure, which defines a method for evaluating the effect of near electric, magnetic or electromagnetic field components on an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to testing an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan immunity between different ICs, the standardized test board defined in IEC 62132‑1 should be used.
This measurement method provides a mapping of the sensitivity (immunity) to electric- or magnetic-near-field disturbance over the IC. The resolution of the test is determined by the capability of the test probe and the precision of the Probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. The tests described in this document are carried out in the frequency domain using continuous wave (CW), amplitude modulated (AM) or pulse modulated (PM) signals.
PDF Catalog
PDF Pages | PDF Title |
---|---|
4 | English CONTENTS |
6 | FOREWORD |
8 | INTRODUCTION |
9 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviations 3.1 Terms and definitions |
10 | 3.2 Abbreviations 4 General |
11 | 5 Test Conditions 5.1 General 5.2 Supply voltage 5.3 Frequency range 6 Test equipment 6.1 General 6.2 Shielding 6.3 RF disturbance generator 6.4 Cables |
12 | 6.5 Near-field probe 6.5.1 General 6.5.2 Magnetic (H) field probe 6.5.3 Electric (E) field probe 6.6 Probe-positioning and data acquisition system |
13 | 6.7 DUT monitor 7 Test setup 7.1 General 7.2 Test configuration Figures Figure 1 – Example of a probe-positioning system |
14 | 7.3 Test circuit board 7.4 Probe-positioning system software setup 7.5 DUT Software 8 Test procedure 8.1 General Figure 2 – Test setup |
15 | 8.2 Operational check 8.3 Immunity test 8.3.1 General 8.3.2 Amplitude modulation 8.3.3 Test frequency steps and ranges 8.3.4 Test levels and dwell time Tables Table 1 – Frequency step size versus frequency range |
16 | 8.3.5 DUT monitoring 8.3.6 Detailed procedure |
17 | 9 Test report 9.1 General 9.2 Test conditions 9.3 Probe design and calibration 9.4 Test data |
18 | 9.5 Post-processing 9.6 Data exchange Figure 3 – Example of data overlaid on an image of the DUT |
19 | Annex A (informative)Calibration of near-field probes A.1 General |
20 | Table A.1 – Probe factor linear units Table A.2 – Probe factor logarithmic units |
21 | Figure A.1 – Typical probe factor in dB (.m2) against frequency Figure A.2 – Typical probe factor in dB (S/m2) against frequency |
22 | A.2 Test equipment A.3 Calibration setup A.4 Calibration procedure Figure A.3 – Probe calibration setup |
24 | Annex B (informative) Electric and magnetic field probes B.1 General B.2 Probe electrical description B.3 Probe physical description B.3.1 Probe construction Figure B.1 – Basic structure of electric and magnetic field probe schematics |
25 | B.3.2 Electric field probe B.3.3 Magnetic field probe Figure B.2 – Example of electric field probe construction (EZ) Figure B.3 – Example of magnetic field probe construction (HX or HY) |
26 | Annex C (informative)Coordinate systems C.1 General C.2 Cartesian coordinate system Figure C.1 – Right-hand Cartesian coordinate system (preferred) |
27 | C.3 Cylindrical coordinate system Figure C.2 – Left-hand Cartesian coordinate system Figure C.3 – Cylindrical coordinate system |
28 | C.4 Spherical coordinate system C.5 Coordinate system conversion Figure C.4 – Spherical coordinate system Table C.1 – Coordinate system conversion |
29 | Bibliography |