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BSI PD IEC/TS 62132-9:2014

$142.49

Integrated circuits. Measurement of electromagnetic immunity – Measurement of radiated immunity. Surface scan method

Published By Publication Date Number of Pages
BSI 2014 32
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This part of IEC 62132 provides a test procedure, which defines a method for evaluating the effect of near electric, magnetic or electromagnetic field components on an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to testing an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan immunity between different ICs, the standardized test board defined in IEC 62132‑1 should be used.

This measurement method provides a mapping of the sensitivity (immunity) to electric- or magnetic-near-field disturbance over the IC. The resolution of the test is determined by the capability of the test probe and the precision of the Probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. The tests described in this document are carried out in the frequency domain using continuous wave (CW), amplitude modulated (AM) or pulse modulated (PM) signals.

PDF Catalog

PDF Pages PDF Title
4 English

CONTENTS
6 FOREWORD
8 INTRODUCTION
9 1 Scope
2 Normative references
3 Terms, definitions and abbreviations
3.1 Terms and definitions
10 3.2 Abbreviations
4 General
11 5 Test Conditions
5.1 General
5.2 Supply voltage
5.3 Frequency range
6 Test equipment
6.1 General
6.2 Shielding
6.3 RF disturbance generator
6.4 Cables
12 6.5 Near-field probe
6.5.1 General
6.5.2 Magnetic (H) field probe
6.5.3 Electric (E) field probe
6.6 Probe-positioning and data acquisition system
13 6.7 DUT monitor
7 Test setup
7.1 General
7.2 Test configuration
Figures

Figure 1 – Example of a probe-positioning system
14 7.3 Test circuit board
7.4 Probe-positioning system software setup
7.5 DUT Software
8 Test procedure
8.1 General
Figure 2 – Test setup
15 8.2 Operational check
8.3 Immunity test
8.3.1 General
8.3.2 Amplitude modulation
8.3.3 Test frequency steps and ranges
8.3.4 Test levels and dwell time
Tables

Table 1 – Frequency step size versus frequency range
16 8.3.5 DUT monitoring
8.3.6 Detailed procedure
17 9 Test report
9.1 General
9.2 Test conditions
9.3 Probe design and calibration
9.4 Test data
18 9.5 Post-processing
9.6 Data exchange
Figure 3 – Example of data overlaid on an image of the DUT
19 Annex A (informative)Calibration of near-field probes
A.1 General
20 Table A.1 – Probe factor linear units
Table A.2 – Probe factor logarithmic units
21 Figure A.1 – Typical probe factor in dB (.m2) against frequency
Figure A.2 – Typical probe factor in dB (S/m2) against frequency
22 A.2 Test equipment
A.3 Calibration setup
A.4 Calibration procedure
Figure A.3 – Probe calibration setup
24 Annex B (informative) Electric and magnetic field probes
B.1 General
B.2 Probe electrical description
B.3 Probe physical description
B.3.1 Probe construction
Figure B.1 – Basic structure of electric and magnetic field probe schematics
25 B.3.2 Electric field probe
B.3.3 Magnetic field probe
Figure B.2 – Example of electric field probe construction (EZ)
Figure B.3 – Example of magnetic field probe construction (HX or HY)
26 Annex C (informative)Coordinate systems
C.1 General
C.2 Cartesian coordinate system
Figure C.1 – Right-hand Cartesian coordinate system (preferred)
27 C.3 Cylindrical coordinate system
Figure C.2 – Left-hand Cartesian coordinate system
Figure C.3 – Cylindrical coordinate system
28 C.4 Spherical coordinate system
C.5 Coordinate system conversion
Figure C.4 – Spherical coordinate system
Table C.1 – Coordinate system conversion
29 Bibliography
BSI PD IEC/TS 62132-9:2014
$142.49