BSI PD IEC/TS 62239-1:2012
$198.66
Process management for avionics. Management plan – Preparation and maintenance of an electronic components management plan
| Published By | Publication Date | Number of Pages |
| BSI | 2012 | 56 |
This part of the IEC/TS 62239 series defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers and regulatory agencies that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the owners of a complete electronic components management plan are avionics equipment manufacturers. This part of the IEC/TS 62239 series provides the minimum requirements for system development assurance levels according to levels A, B and C of the DO-254 A, B and C for flight equipment.
Although developed for the avionics industry, this process may be applied by other industrial sectors.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 6 | FOREWORD |
| 9 | INTRODUCTION |
| 10 | 1 Scope 2 Normative references |
| 12 | 3 Terms, definitions and abbreviations 3.1 Terms and definitions |
| 16 | 3.2 Abbreviations 4 Technical requirements 4.1 General |
| 17 | 4.2 Component selection |
| 18 | 4.3 Component application 4.3.1 General 4.3.2 Electromagnetic compatibility (EMC) |
| 19 | 4.3.3 Derating and stress analysis 4.3.4 Thermal analysis |
| 20 | 4.3.5 Mechanical analysis 4.3.6 Testing, testability, and maintainability 4.3.7 Avionics radiation environment 4.3.8 Management of lead-free termination finish and soldering |
| 21 | 4.3.9 Counterfeit, fraudulent and recycled component avoidance 4.4 Component qualification 4.4.1 General 4.4.2 General component qualification requirements 4.4.3 Component manufacturer quality management 4.4.4 Component manufacturer process management approval |
| 22 | 4.4.5 Demonstration of component qualification |
| 23 | 4.4.6 Qualification of components from a supplier that is not qualified 4.4.7 Distributor process management approval |
| 24 | 4.4.8 Subcontractor assembly facility quality and process management approval 4.5 Continuous component quality assurance 4.5.1 General quality assurance requirements 4.5.2 On-going component quality assurance |
| 25 | 4.5.3 Plan owner in-house continuous monitoring 4.5.4 Component design and manufacturing process change monitoring 4.6 Component availability and associated risk assessment 4.6.1 General |
| 26 | 4.6.2 Component obsolescence 4.6.3 Pro-active measures |
| 27 | 4.6.4 Component obsolescence awareness 4.6.5 Reporting 4.6.6 Component dependability 4.6.7 Semiconductor reliability and wear out 4.6.8 Reliability assessment |
| 28 | 4.7 Component compatibility with the equipment manufacturing process 4.8 Component data |
| 29 | 4.9 Configuration control 4.9.1 General 4.9.2 Alternative sources 4.9.3 Equipment change documentation |
| 30 | 4.9.4 Customer notifications and approvals 4.9.5 Focal organisation 5 Plan administration requirements 5.1 Using components outside the manufacturer’s specified temperature range 5.2 Plan organization |
| 31 | 5.3 Plan terms and definitions 5.4 Plan focal point 5.5 Plan references 5.6 Plan applicability 5.7 Plan implementation 5.8 Plan acceptance 5.9 Plan maintenance |
| 32 | Annex A (informative) Typical qualification requirements, typical component minimum qualification requirements |
| 33 | Table A.1 – Typical qualification requirements, typical component minimum qualification requirements |
| 36 | Annex B (informative) Semiconductor reliability and wear out |
| 37 | Annex C (informative) Guidelines for environmental protection techniques, and for comparison of components specifications Table C.1 – Environmental protection techniques to be considered during the avionics design process |
| 42 | Table C.2 – Guidelines for the comparison of internationally available component specifications – Microcircuitsa |
| 52 | Bibliography |
