BSI PD IEC TS 62607-8-3:2023
$102.76
Nanomanufacturing. Key Control Characteristics – Nano-enabled metal-oxide interfacial devices. Analogue resistance change and resistance fluctuation: Electrical resistance measurement
Published By | Publication Date | Number of Pages |
BSI | 2023 | 22 |
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
4 | CONTENTS |
5 | FOREWORD |
7 | INTRODUCTION |
8 | 1 Scope 2 Normative references 3 Terms, definitions, acronyms, and abbreviated terms 3.1 Terms and definitions |
9 | 3.2 Terms specific to this document 3.3 Abbreviated terms 4 Measurement of resistance 4.1 General |
10 | 4.2 Method for processing and fabrication of DUT 4.3 Experimental procedures Figures Figure 1 – Example of the experimental schematic diagram for the resistance measurement Figure 2 – Photos of the sample stage |
11 | 5 Reporting data 6 Data analysis and interpretation of results 6.1 General Tables Table 1 – Measurement sequence of analogue resistance change and its parameters |
12 | 6.2 Parameter fitting 6.3 Interpretation of results |
13 | Annex A (informative)Case study A.1 Measurement of the analogue change and the fluctuation of the resistance A.1.1 General A.1.2 I-V measurement of TiN/Ta-oxide/TiN Figure A.1 – Transmission electron microscopy image of TiN/Ta-oxide/TiN |
14 | Figure A.2 – DC I-V measurement |
15 | Figure A.3 – Pulse measurement Figure A.4 – Initial measurement Figure A.5 – Repeated measurement |
16 | Figure A.6 – Post-measurement characterization Table A.1 – Measurement sequence of analogue resistance change and its parameters (case study) |
17 | A.1.3 Data analysis |
18 | Figure A.7 – Conductance increasing process Figure A.8 – Normalized conductance in increasing process Figure A.9 – Conductance decreasing process |
19 | Figure A.10 – Normalized conductance in decreasing process Table A.2 – Results of parameter fitting Table A.3 – Results of parameter fitting using normalized conductance (normalize range = ∆Gmax in Table A.2) |
20 | Bibliography |