DIN EN IEC 61188-6-1:2019 Edition

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Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design – Generic requirements for land pattern on circuit boards (Draft)

Published By	Publication Date	Number of Pages
DIN	2019-07	54

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Categories: 31.180 - Printed circuits and boards, 31.190 - Electronic component assemblies, DIN

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Description

This International Standard specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1 to IEC 61191-4.

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2019-07
Pages Count	54
Language	Germany
Descriptors	Definitions, Design, Drawings, Electrical engineering, Electronic engineering, Electronic equipment and components, Equipment, Land pattern, Printed circuits, Printed-circuit boards, Semiconductor devices, SMD, Solderings, Specification (approval), Surface mounting, Surface mounting devices
File Size	2.0 MB
ICS Codes	31.180 - Printed circuits and boards 31.190 - Electronic component assemblies

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DIN EN IEC 61188-6-1:2019 Edition

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