IEC 60191-6-5:2001
$13.65
Mechanical standardization of semiconductor devices – Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch ball grid array (FBGA)
| Published By | Publication Date | Number of Pages |
| IEC | 2001-08-27 | 16 |
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
