IEC 61189-2:2006
$72.80
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures
Published By | Publication Date | Number of Pages |
IEC | 2006-05-30 | 128 |
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Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Published Code | IEC |
---|---|
Published By | International Electrotechnical Commission |
Publication Date | 2006-05-30 |
Pages Count | 128 |
Language | English |
Edition | 2.0 |
File Size | 1.2 MB |
ICS Codes | 31.180 - Printed circuits and boards |
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